SCHEMBL204086

SCHEMBL204086

C/C=C(/[O])CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL204087 1.00
SCHEMBL866732 1.00
SCHEMBL3416735 0.72
SCHEMBL710099 0.72
SCHEMBL3416736 0.72
SCHEMBL710100 0.72
SCHEMBL713756 0.72
SCHEMBL3412425 0.72
SCHEMBL4135715 0.67
SCHEMBL4135718 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 660 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0332400-B1 Photocurable organopolysiloxane composition SHINETSU CHEMICAL CO (JP) 1994-11-30 EP claimed
US-12035467-B2 Circuit structure TICONA LLC (US) 2024-07-09 US disclosed
US-12031059-B2 Mixture curable to provide an intumescent coating material ADVANCED INNERGY LTD (GB) 2024-07-09 US disclosed
US-12032272-B2 Polymer composition for use in a camera module TICONA LLC (US) 2024-07-09 US disclosed
WO-2024137270-A1 WEATHER SEALING DOW SILICONES CORPORATION (US) 2024-06-27 WO disclosed
US-20240199912-A1 ROOM-TEMPERATURE-CURABLE SILICONE COATING COMPOSITION AND ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-20 US disclosed
US-20240191110-A1 CURABLE RESIN COMPOSITION, A CURED PRODUCT, A LAMINATED BODY COMPOSED OF A CURED PRODUCT, AND A METHOD FOR DISASSEMBLING THEREOF THREEBOND CO., LTD. (JP) 2024-06-13 US disclosed
EP-4382543-A1 A CURABLE RESIN COMPOSITION, A CURED PRODUCT, A LAMINATED BODY COMPOSED OF A CURED PRODUCT, AND A METHOD FOR DISASSEMBLING THEREOF ThreeBond Co., Ltd. (JP) 2024-06-12 EP disclosed
CN-118146724-A Curable resin composition, cured product, laminate comprising cured product, and method for disassembling laminate 三键有限公司 2024-06-07 CN disclosed
US-20240182707-A1 POLYCARBONATE BLEND COMPOSITIONS HAVING IMPROVED WEATHERABILITY AND SCRATCH RESISTANCE COVESTRO LLC 2024-06-06 US disclosed
US-4950701-A POLYSILOXANE ADHESIVE WITH A AROMATIC AMINE PROMOTER CEMEDINE COMPANY, LTD. (JP) 1990-08-21 US disclosed
US-4793886-A TWO PART-CYANOACRYLATE AND 1,1-DISUBSTITUTED COMPOUND WITH SELF-CURING ADHESIVE CEMEDINE CO., LTD. (JP) 1988-12-27 US disclosed
US-4769412-A POLYSILOXANE, ORGANOSILICON COMPOUND, CATALYST, CARBON BLACK, AND IRON OXIDE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1988-09-06 US disclosed
EP-0271296-A2 Syntactic sealants DOW CORNING CORPORATION (US) 1988-06-15 EP disclosed
US-4695603-A FLUORINATED SURFACTANT, AMIDE-SUBSTITUTED SILOXANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1987-09-22 US disclosed
US-4683251-A Room temperature-curable organopolysiloxane composition containing a photosensitizer TORAY SILICONE CO., LTD. (JP) 1987-07-28 US disclosed
US-4683250-A Room-temperature-curable silicon-modified polyether composition TORAY SILICONE CO., LTD. (JP) 1987-07-28 US disclosed
EP-0228087-A2 Room-temperature curable silicone-modified polyether composition Toray Silicone Company Limited (JP) 1987-07-08 EP disclosed
EP-0215215-A2 Room temperature-curable organopolysiloxane composition containing a photosensitizer Toray Silicone Company, Ltd. (JP) 1987-03-25 EP disclosed
EP-0210442-A2 Room temperature-curable organopolysiloxane composition Toray Silicone Company, Ltd. (JP) 1987-02-04 EP disclosed