⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL866732 | 1.00 | — | — | |
| SCHEMBL204086 | 1.00 | — | — | |
| SCHEMBL3416735 | 0.72 | — | — | |
| SCHEMBL710099 | 0.72 | — | — | |
| SCHEMBL3416736 | 0.72 | — | — | |
| SCHEMBL710100 | 0.72 | — | — | |
| SCHEMBL713756 | 0.72 | — | — | |
| SCHEMBL3412425 | 0.72 | — | — | |
| SCHEMBL4135715 | 0.67 | — | — | |
| SCHEMBL4135718 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 992 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117999316-A | Moisture curable composition | 美国陶氏有机硅公司 | 2024-05-07 | — | — | CN | claimed |
| CN-117980413-A | Moisture curable composition | 美国陶氏有机硅公司 | 2024-05-03 | — | — | CN | claimed |
| WO-2023055681-A1 | MOISTURE CURABLE COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2023-04-06 | — | — | WO | claimed |
| WO-2023055680-A1 | MOISTURE CURABLE COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2023-04-06 | — | — | WO | claimed |
| EP-0332400-B1 | Photocurable organopolysiloxane composition | SHINETSU CHEMICAL CO (JP) | 1994-11-30 | — | — | EP | claimed |
| EP-0332400-A2 | Photocurable organopolysiloxane composition | Shin-Etsu Chemical Co., Ltd. (JP) | 1989-09-13 | — | — | EP | claimed |
| US-12035467-B2 | Circuit structure | TICONA LLC (US) | 2024-07-09 | — | — | US | disclosed |
| US-12031059-B2 | Mixture curable to provide an intumescent coating material | ADVANCED INNERGY LTD (GB) | 2024-07-09 | — | — | US | disclosed |
| US-12032272-B2 | Polymer composition for use in a camera module | TICONA LLC (US) | 2024-07-09 | — | — | US | disclosed |
| WO-2024137270-A1 | WEATHER SEALING | DOW SILICONES CORPORATION (US) | 2024-06-27 | — | — | WO | disclosed |
| US-20240199912-A1 | ROOM-TEMPERATURE-CURABLE SILICONE COATING COMPOSITION AND ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-20 | — | — | US | disclosed |
| CN-113242897-B | Adhesive agent | 美国陶氏有机硅公司 | 2024-06-14 | — | — | CN | disclosed |
| US-20240191110-A1 | CURABLE RESIN COMPOSITION, A CURED PRODUCT, A LAMINATED BODY COMPOSED OF A CURED PRODUCT, AND A METHOD FOR DISASSEMBLING THEREOF | THREEBOND CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-4683251-A | Room temperature-curable organopolysiloxane composition containing a photosensitizer | TORAY SILICONE CO., LTD. (JP) | 1987-07-28 | — | — | US | disclosed |
| EP-0228087-A2 | Room-temperature curable silicone-modified polyether composition | Toray Silicone Company Limited (JP) | 1987-07-08 | — | — | EP | disclosed |
| US-4673621-A | COPOLYMER OF PERFLUOROALKYL VINYL MONOMER AND A VINYL-CONTAINING ORGANOSILICON COMPOUND WITH AT LEAST ONE HYDROLYZABLE GROUP | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1987-06-16 | — | — | US | disclosed |
| EP-0215215-A2 | Room temperature-curable organopolysiloxane composition containing a photosensitizer | Toray Silicone Company, Ltd. (JP) | 1987-03-25 | — | — | EP | disclosed |
| EP-0210442-A2 | Room temperature-curable organopolysiloxane composition | Toray Silicone Company, Ltd. (JP) | 1987-02-04 | — | — | EP | disclosed |
| EP-0203798-A2 | Nitrogen-containing heterocyclic compounds, and their production and use | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1986-12-03 | — | — | EP | disclosed |
| US-4460740-A | FLUORINE CONTAINING SURFACTANT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1984-07-17 | — | — | US | disclosed |