SCHEMBL2044696

SCHEMBL2044696

COCCOCCC(CCOCCOC)(CC(=O)O)C(=O)O

nearest known ligand 0.34

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.34
TSHR P16473 1/20 0.34
CYP2C19 P33261 1/20 0.34
HIF1A Q16665 1/20 0.34
ALDH1A1 P00352 2/20 0.34
ARG1 P05089 1/20 0.32
ARG2 P78540 1/20 0.32
FFAR1 O14842 1/20 0.31
CPT2 P23786 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
HMGCR P04035 1/20 0.31
CHRM1 P11229 1/20 0.31
TBXA2R P21731 1/20 0.31
ADRA1A P35348 1/20 0.31
BLM P54132 1/20 0.31
PMP22 Q01453 1/20 0.31
HSD17B10 Q99714 1/20 0.31
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10322965 0.85 ALDH1A1 (0.39) CYP2D6TSHRCYP2C19HIF1AALDH1A1
SCHEMBL3689750 0.85 ALDH1A1 (0.39) CYP2D6TSHRCYP2C19HIF1AALDH1A1
SCHEMBL10926439 0.84 ALDH1A1 (0.41) TSHRALDH1A1ARG1ARG2
SCHEMBL16837165 0.82 TSHR (0.39) TSHRALDH1A1BLM
SCHEMBL16837174 0.82 TSHR (0.39) TSHRALDH1A1BLM
SCHEMBL3690393 0.82 TSHR (0.39) TSHRALDH1A1BLM
SCHEMBL1301903 0.81 ALDH1A1 (0.38) CYP2D6TSHRCYP2C19HIF1AALDH1A1
SCHEMBL16353977 0.81 ALDH1A1 (0.47) TSHRALDH1A1ARG1ARG2FFAR1
SCHEMBL2690681 0.81 ALDH1A1 (0.47) TSHRALDH1A1ARG1ARG2FFAR1
SCHEMBL1302514 0.80 TSHR (0.41) TSHRALDH1A1FFAR1CPT2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110160364-A1 RESIN COMPOSITION, MANUFACTURING METHOD THEREOF, AND MOLDED ARTICLE TEIJIN LIMITED (JP) 2011-06-30 US disclosed
US-20100324220-A1 RESIN COMPOSITION AND MOLDED ARTICLE TEIJIN LIMITED (JP) 2010-12-23 US disclosed
EP-2256165-A1 RESIN COMPOSITION AND MOLDED ARTICLE Teijin Limited (JP) 2010-12-01 EP disclosed
US-7803298-B2 Molding material, molded part, and method for manufacturing them SUMITOMO ELECTRIC FINE POLYMER, INC. (JP) 2010-09-28 US disclosed
EP-2053091-A1 RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME AND MOLDED ARTICLE TEIJIN LIMITED (JP) 2009-04-29 EP disclosed
US-20090030160-A1 Polylactic Acid Complex and Production Method Thereof SUMITOMO ELECTRIC FINE POLYMER INC. (JP) 2009-01-29 US disclosed
US-20080036119-A1 Molding material, molded part, and method for manufacturing them SUMITOMO ELECTRIC FINE POLYMER, INC. 2008-02-14 US disclosed