SCHEMBL2045372

SCHEMBL2045372

Cc1cc(CCC(=O)OCCOCCOCCOC(=O)CCc2cc(C)c(O)c(C)c2)cc(C)c1O

nearest known ligand 0.49

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 1/20 0.49
APP P05067 2/20 0.47
TDP1 Q9NUW8 1/20 0.47
CYP4F2 P78329 1/20 0.42
CYP4A11 Q02928 1/20 0.42
ALDH1A1 P00352 1/20 0.41
PTGS1 P23219 2/20 0.41
PTGS2 P35354 2/20 0.41
SERPINE1 P05121 1/20 0.41
ESR1 P03372 2/20 0.41
S1PR1 P21453 1/20 0.38
HMGB1 P09429 1/20 0.38
CXCL12 P48061 1/20 0.38
CYP4Z1 Q86W10 1/20 0.38
TNKS2 Q9H2K2 1/20 0.36
MAOA P21397 1/20 0.36
MAOB P27338 1/20 0.36
CISD1 Q9NZ45 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6071507 0.95 ALOX5 (0.52) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL13899105 0.92 CYP4F2 (0.46) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL19047012 0.92 ALOX5 (0.57) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL17264213 0.90 ALOX5 (0.49) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL21704566 0.90 ALOX5 (0.49) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL12386503 0.90 ALOX5 (0.49) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL14979029 0.90 ALOX5 (0.44) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL9226392 0.89 ALOX5 (0.48) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL11735453 0.89 ALOX5 (0.51) ALOX5APPTDP1CYP4F2CYP4A11
SCHEMBL13121602 0.89 CYP4F2 (0.49) ALOX5APPTDP1CYP4F2CYP4A11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122060318-A Nylon alloy material and preparation method and application thereof 上海金发科技发展有限公司 2026-05-19 CN disclosed
CN-122037520-A PC/ABS composition, and preparation method and application thereof 武汉金发科技有限公司 2026-05-15 CN disclosed
CN-116987367-B Polyester composition and preparation method and application thereof 珠海万通特种工程塑料有限公司 2025-06-24 CN disclosed
CN-117343496-B PBT composite material and preparation method and application thereof 金发科技股份有限公司 2025-06-03 CN disclosed
CN-120059338-A Polypropylene composition and preparation method and application thereof 上海金发科技发展有限公司 2025-05-30 CN disclosed
CN-119955287-A Polyphenyl ether/polyamide alloy and preparation method and application thereof 金发科技股份有限公司 2025-05-09 CN disclosed
CN-115975354-B PBT composite material and preparation method and application thereof 金发科技股份有限公司 2025-04-29 CN disclosed
CN-119570246-A Flame-retardant polyamide composite material and preparation method and application thereof 金发科技股份有限公司 2025-03-07 CN disclosed
CN-119490712-A Regenerated polypropylene composite material and preparation method and application thereof 上海金发科技发展有限公司 2025-02-21 CN disclosed
CN-116769305-B High-temperature nylon composition and preparation method and application thereof 珠海万通特种工程塑料有限公司 2025-02-11 CN disclosed
US-20150318072-A1 CARBON NANOTUBE-POLYOXYMETHYLENE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSABILITY AND HEAT STABILITY, AND MOLDED ARTICLE FORMED THEREFROM KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2015-11-05 US disclosed
EP-2940074-A1 CARBON NANOTUBE-POLYOXYMETHYLENE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSING PROPERTIES AND HEAT STABILITY, AND MOLDED ARTICLE THEREOF Korea Engineering Plastics Co., Ltd (KR) 2015-11-04 EP disclosed
US-8846788-B2 Polyacetal resin composition, resin molded article, and method and agent for improving polyacetal resin raw material composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2014-09-30 US disclosed
US-20110230602-A1 POLYACETAL RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD AND AGENT FOR IMPROVING POLYACETAL RESIN RAW MATERIAL COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-09-22 US disclosed
EP-2330155-A1 POLYACETAL RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD AND AGENT FOR IMPROVING POLYACETAL RESIN RAW MATERIAL COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-06-08 EP disclosed
US-20080097012-A1 Polyoxymethylene Resin Composition Having An Excellent Heat Stability KOREA ENGINEERING PLASTIC CO., LTD. 2008-04-24 US disclosed
WO-2005026259-A1 POLYOXYMETHYLENE RESIN COMPOSITION WITH EXCELLENT HEAT STABILITY KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2005-03-24 WO disclosed
EP-0957128-B1 Polyoxymethylene resin composition MITSUBISHI GAS CHEMICAL CO (JP) 2002-10-09 EP disclosed
US-6211268-B1 COPOLYMERS OF OXYMETHYLENE AND ETHYLENE GLYCOL POLYMER WITH PHENOL IN THE PRESENCE OF AMINE SUBSTITUTED TRIAZINE MITSUBISHI GAS CHEMICAL CO INC (JP) 2001-04-03 US disclosed
EP-0957128-A2 Polyoxymethylene resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1999-11-17 EP disclosed