SCHEMBL20472255

SCHEMBL20472255

CCCCCCCCCC(O)C(N)=O

nearest known ligand 0.65

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.65
FFAR1 O14842 2/20 0.65
FFAR4 Q5NUL3 1/20 0.48
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
SPHK1 Q9NYA1 1/20 0.48
EPHX1 P07099 1/20 0.47
MAPT P10636 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5575801 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL13849594 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL20472582 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL5575803 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL4957808 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL4850662 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL15007874 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL3761975 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL34950 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2
SCHEMBL15007853 1.00 GPR84 (0.65) GPR84FFAR1FFAR4CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250043165-A1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2025-02-06 US disclosed
US-20240294780-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2024-09-05 US disclosed
EP-4363511-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG Industries Ohio Inc. (US) 2024-05-08 EP disclosed
EP-3580290-B1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG IND OHIO INC (US) 2024-05-01 EP disclosed
US-11952514-B2 Low-temperature curing adhesive compositions PPG INDUSTRIES OHIO, INC. (US) 2024-04-09 US disclosed
WO-2023279087-A1 ELECTRODEPOSITABLE COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2023-01-05 WO disclosed
EP-3580253-B1 LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS PPG IND OHIO INC (US) 2021-04-07 EP disclosed
WO-2018148306-A1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2018-08-16 WO disclosed
WO-2018148323-A1 LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2018-08-16 WO disclosed
CN-104350120-B The polymer of containing silane groups SIKA技术股份公司 2016-08-24 CN disclosed