SCHEMBL20495654

SCHEMBL20495654

CC(NCc1cccc2ccccc12)NCc1cccc2ccccc12

nearest known ligand 0.62

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.56
KDM4E B2RXH2 1/20 0.56
ALDH1A1 P00352 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
CA2 P00918 1/20 0.50
ANPEP P15144 1/20 0.49
CYP1A2 P05177 2/20 0.48
CYP2C19 P33261 2/20 0.48
CYP2D6 P10635 1/20 0.48
SIGMAR1 Q99720 2/20 0.48
MC5R P33032 2/20 0.47
MAPK1 P28482 1/20 0.47
CYP2C9 P11712 1/20 0.47
MEN1 O00255 1/20 0.46
MC1R Q01726 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8851088 0.89 BCHE (0.57) KMT2AKDM4EALDH1A1TDP1CA2
SCHEMBL21643605 0.86 KMT2A (0.58) KMT2AKDM4EALDH1A1TDP1CA2
SCHEMBL15797480 0.84 KMT2A (0.59) KMT2AKDM4EALDH1A1TDP1CA2
SCHEMBL29864849 0.82 KMT2A (0.57) KMT2AKDM4EALDH1A1TDP1CYP1A2
SCHEMBL3672190 0.82 KMT2A (0.57) KMT2AKDM4EALDH1A1TDP1CYP1A2
SCHEMBL3672185 0.82 KMT2A (0.57) KMT2AKDM4EALDH1A1TDP1CYP1A2
SCHEMBL9674056 0.82 KMT2A (0.57) KMT2AKDM4EALDH1A1TDP1CYP1A2
SCHEMBL20495653 0.81 KMT2A (0.60) KMT2AKDM4EALDH1A1TDP1CA2
SCHEMBL30305243 0.81 KMT2A (0.60) KMT2AKDM4EALDH1A1TDP1CA2
SCHEMBL15741913 0.80 KMT2A (0.63) KMT2AKDM4EALDH1A1TDP1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11225588-B2 Method for producing a curing agent for low-emission epoxy resin compositions SIKA TECHNOLOGY AG (CH) 2022-01-18 US disclosed
EP-3596150-B1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-07 EP disclosed
US-20200040215-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2020-02-06 US disclosed
WO-2018166996-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-20 WO disclosed
EP-3375802-A1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed