SCHEMBL20495653

SCHEMBL20495653

CC(CNCc1cccc2ccccc12)NCc1cccc2ccccc12

nearest known ligand 0.71

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.60
KDM4E B2RXH2 1/20 0.57
ALDH1A1 P00352 1/20 0.57
TDP1 Q9NUW8 1/20 0.57
DNM1 Q05193 1/20 0.51
MC5R P33032 2/20 0.49
MAPK1 P28482 1/20 0.49
MEN1 O00255 1/20 0.48
MC1R Q01726 1/20 0.48
HPGD P15428 1/20 0.48
SIGMAR1 Q99720 2/20 0.46
ADRB2 P07550 4/20 0.45
CA2 P00918 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30305243 1.00 KMT2A (0.60) KMT2AKDM4EALDH1A1TDP1DNM1
SCHEMBL17240223 0.85 DNM1 (0.55) KMT2ADNM1MC5RMAPK1MEN1
SCHEMBL15797480 0.83 KMT2A (0.59) KMT2AKDM4EALDH1A1TDP1MC5R
SCHEMBL21643605 0.82 KMT2A (0.58) KMT2AKDM4EALDH1A1TDP1MC5R
SCHEMBL20495646 0.82 DNM1 (0.52) KMT2AKDM4EALDH1A1TDP1DNM1
SCHEMBL20824982 0.82 DNM1 (0.52) KMT2AKDM4EALDH1A1TDP1DNM1
SCHEMBL13995739 0.82 DNM1 (0.52) KMT2AKDM4EALDH1A1TDP1DNM1
SCHEMBL8851088 0.81 BCHE (0.57) KMT2AKDM4EALDH1A1TDP1MC5R
SCHEMBL20495654 0.81 KMT2A (0.56) KMT2AKDM4EALDH1A1TDP1MC5R
SCHEMBL6008064 0.78 MC5R (0.70) KMT2ADNM1MC5RMAPK1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11225588-B2 Method for producing a curing agent for low-emission epoxy resin compositions SIKA TECHNOLOGY AG (CH) 2022-01-18 US disclosed
EP-3596150-B1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-07 EP disclosed
US-20200040215-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2020-02-06 US disclosed
EP-3375802-A1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed