SCHEMBL20508245

SCHEMBL20508245

CC(=O)OC(F)C(O)(F)F

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.42
TDP1 Q9NUW8 1/20 0.34
ALOX15 P16050 1/20 0.33
CHRM2 P08172 1/20 0.32
CHRM4 P08173 1/20 0.32
CHRM1 P11229 1/20 0.32
TBXA2R P21731 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.31
LMNA P02545 1/20 0.31
GALR3 O60755 1/20 0.31
MAPT P10636 1/20 0.31
BLM P54132 1/20 0.31
ALDH1A1 P00352 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4863907 0.82 TSHR (0.43) TSHRTDP1ALOX15CHRM2CHRM4
SCHEMBL701398 0.78 TSHR (0.40) TSHRTDP1CHRM2CHRM4CHRM1
SCHEMBL29207112 0.78 TSHR (0.40) TSHRTDP1CHRM2CHRM4CHRM1
SCHEMBL29031302 0.78 TSHR (0.40) TSHRTDP1CHRM2CHRM4CHRM1
SCHEMBL31195836 0.78 ALDH1A1 (0.39) TSHRALDH1A1
SCHEMBL5704617 0.76 TSHR (0.39) TSHRTDP1CHRM2CHRM4CHRM1
SCHEMBL20547899 0.75 TSHR (0.37) TSHRTDP1
SCHEMBL16072442 0.73 TSHR (0.36) TSHRTDP1ALDH1A1
SCHEMBL9790297 0.72 TSHR (0.38) TSHRTDP1MAPT
SCHEMBL12019080 0.70 TSHR (0.42) TSHRTDP1CHRM2CHRM4CHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3398983-B1 POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHINETSU CHEMICAL CO (JP) 2023-09-27 EP disclosed
US-11150556-B2 Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-19 US disclosed
EP-3398983-A1 POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS Shin-Etsu Chemical Co., Ltd. (JP) 2018-11-07 EP disclosed
US-20180275513-A1 POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-09-27 US disclosed