⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9405109 | 0.91 | — | — | |
| SCHEMBL141142 | 0.82 | — | — | |
| SCHEMBL1161817 | 0.73 | — | — | |
| SCHEMBL3796487 | 0.73 | — | — | |
| SCHEMBL2540949 | 0.72 | — | — | |
| SCHEMBL1577019 | 0.72 | — | — | |
| SCHEMBL12805247 | 0.68 | — | — | |
| SCHEMBL4535091 | 0.68 | — | — | |
| SCHEMBL8896421 | 0.68 | — | — | |
| SCHEMBL13274534 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11502402-B2 | Integrated patch antenna having insulating substrate with antenna cavity and high-K dielectric | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-11-15 | — | — | US | claimed |
| US-20200295453-A1 | INTEGRATED PATCH ANTENNA HAVING INSULATING SUBSTRATE WITH ANTENNA CAVITY AND HIGH-K DIELECTRIC | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2020-09-17 | — | — | US | claimed |
| EP-3540281-B1 | PIEZOELECTRIC VALVE MODULE, METHOD FOR MANUFACTURING THE VALVE MODULE, AND RESPIRATORY AID DEVICE INCLUDING ONE OR MORE VALVE MODULES | ST MICROELECTRONICS SRL (IT) | 2024-02-21 | — | — | EP | disclosed |
| US-20220368012-A1 | INTEGRATED PATCH ANTENNA HAVING AN INSULATING SUBSTRATE WITH AN ANTENNA CAVITY AND A HIGH-K DIELECTRIC | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-11-17 | — | — | US | disclosed |
| US-11502402-B2 | Integrated patch antenna having insulating substrate with antenna cavity and high-K dielectric | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-11-15 | — | — | US | disclosed |
| EP-3381690-B1 | FLUID EJECTION DEVICE HAVING A CROSSTALK REDUCTION ELEMENT, PRINTHEAD INCLUDING THE EJECTION DEVICE, PRINTER INCLUDING THE PRINTHEAD, AND METHOD FOR MANUFACTURING THE EJECTION DEVICE | ST MICROELECTRONICS SRL (IT) | 2022-04-20 | — | — | EP | disclosed |
| US-11084283-B2 | Methods of forming and using fluid ejection devices and printheads | STMICROELECTRONICS S.R.L. (IT) | 2021-08-10 | — | — | US | disclosed |
| CN-108656747-B | Fluid ejection device, printhead, printer, and method for manufacturing ejection device | 意法半导体股份有限公司 | 2021-03-19 | — | — | CN | disclosed |
| US-10941880-B2 | Piezoelectric valve module, method for manufacturing the valve module, method for operating the valve module, and respiratory aid device including one or more of the valve modules | STMICROELECTRONICS S.R.L. (IT) | 2021-03-09 | — | — | US | disclosed |
| US-20200295453-A1 | INTEGRATED PATCH ANTENNA HAVING INSULATING SUBSTRATE WITH ANTENNA CAVITY AND HIGH-K DIELECTRIC | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2020-09-17 | — | — | US | disclosed |
| US-20200070511-A1 | FLUID EJECTION DEVICE AND PRINTHEAD | ST MICROELECTRONICS SRL (IT) | 2020-03-05 | — | — | US | disclosed |
| US-20190285196-A1 | PIEZOELECTRIC VALVE MODULE, METHOD FOR MANUFACTURING THE VALVE MODULE, METHOD FOR OPERATING THE VALVE MODULE, AND RESPIRATORY AID DEVICE INCLUDING ONE OR MORE OF THE VALVE MODULES | STMICROELECTRONICS S.R.L. (IT) | 2019-09-19 | — | — | US | disclosed |
| EP-3540281-A1 | PIEZOELECTRIC VALVE MODULE, METHOD FOR MANUFACTURING THE VALVE MODULE, METHOD FOR OPERATING THE VALVE MODULE, AND RESPIRATORY AID DEVICE INCLUDING ONE OR MORE VALVE MODULES | STMicroelectronics S.r.l. (IT) | 2019-09-18 | — | — | EP | disclosed |
| US-20180281402-A1 | FLUID EJECTION DEVICE, PRINTHEAD, PRINTER, AND METHOD FOR MANUFACTURING THE EJECTION DEVICE | STMICROELECTRONICS, INC. | 2018-10-04 | — | — | US | disclosed |
| EP-3381690-A1 | FLUID EJECTION DEVICE HAVING A CROSSTALK REDUCTION ELEMENT, PRINTHEAD INCLUDING THE EJECTION DEVICE, PRINTER INCLUDING THE PRINTHEAD, AND METHOD FOR MANUFACTURING THE EJECTION DEVICE | STMicroelectronics S.r.l. (IT) | 2018-10-03 | — | — | EP | disclosed |
| CN-101283115-A | Low-temperature deposition method and device for doped silicon nitride film | APPLIED MATERIALS INC (US) | 2008-10-08 | — | — | CN | disclosed |