SCHEMBL20525342

SCHEMBL20525342

O=C(O)/C=C(\C(=O)O)C1=CC=CC1

nearest known ligand 0.32

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.32
MAPK1 P28482 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
THRB P10828 1/20 0.31
BLM P54132 1/20 0.31
PMP22 Q01453 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6544214 1.00 TSHR (0.32) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL8464359 1.00 TSHR (0.32) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL11691890 0.98 TSHR (0.31) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL30797944 0.84
SCHEMBL2597835 0.78
SCHEMBL156601 0.78
SCHEMBL27920916 0.74
SCHEMBL17329404 0.73 TSHR (0.32) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL7935957 0.73 TSHR (0.32) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL7935963 0.73 TSHR (0.32) TSHRMAPK1HSD17B10TDP1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2976380-B1 DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY Henkel IP & Holding GmbH (DE) 2018-10-10 EP claimed
CN-114478840-B Functionalized reversion liquid rubber and preparation method thereof 杭州中策橡胶循环科技有限公司 2022-09-06 CN disclosed
CN-114478840-A Functionalized reversion liquid rubber and preparation method thereof 杭州中策橡胶循环科技有限公司 2022-05-13 CN disclosed
CN-105683259-B Method for preparing wet gel and its xerogel 佐治亚-太平洋化工品有限公司 2017-11-28 CN disclosed
CN-105579502-B Polyolefin resin expanded particle and expanded particle formed body and the compound stack body with the formed body 株式会社JSP 2017-10-20 CN disclosed