⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22654225 | 0.89 | — | — | |
| SCHEMBL22654271 | 0.87 | — | — | |
| SCHEMBL27396571 | 0.85 | TSHR (0.34) | — | |
| SCHEMBL1262060 | 0.84 | — | — | |
| SCHEMBL931708 | 0.83 | — | — | |
| SCHEMBL931778 | 0.83 | — | — | |
| SCHEMBL1493133 | 0.79 | — | — | |
| SCHEMBL2247641 | 0.79 | — | — | |
| SCHEMBL930830 | 0.79 | — | — | |
| SCHEMBL1263464 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 847 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122071601-A | Environment-friendly semiconductive shielding material and preparation method and application thereof | 中国石油化工股份有限公司 | 2026-05-22 | — | — | CN | claimed |
| CN-122071600-A | Thermoplastic semiconductive composition and preparation method and application thereof | 中国石油化工股份有限公司 | 2026-05-22 | — | — | CN | claimed |
| US-20250188615-A1 | Gapfill Methods and Processing Assemblies | ASM IP HOLDING B.V. (NL) | 2025-06-12 | — | — | US | claimed |
| US-20250092206-A1 | BIAXIALLY ORIENTED POLYPROPYLENE DIELECTRIC FILM, MODIFIED POLYPROPYLENE MATERIAL AND USE THEREOF | Sinopec (Beijing) Research Institute of Chemical Industry Co., Ltd. (CN) | 2025-03-20 | — | — | US | claimed |
| CN-119463276-A | Transparent flexible double-crosslinked silicon-based modified cellulose aerogel and preparation method thereof | 湖北兴瑞硅材料有限公司 | 2025-02-18 | — | — | CN | claimed |
| CN-115991908-B | Polypropylene composite film and preparation method and application thereof | 中国石油化工股份有限公司 | 2024-12-06 | — | — | CN | claimed |
| US-20240352241-A1 | MODIFIED FLEXIBLE POLYPROPYLENE INSULATING MATERIAL AND PREPARATION METHOD AND USE THEREOF | BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATION (CN) | 2024-10-24 | — | — | US | claimed |
| CN-116063784-B | Electrically insulating thermoplastic composite material containing silane modified polypropylene grafts, method for the production and use thereof | 中国石油化工股份有限公司 | 2024-10-15 | — | — | CN | claimed |
| CN-115991031-B | Polypropylene composite film and preparation method and application thereof | 中国石油化工股份有限公司 | 2024-08-06 | — | — | CN | claimed |
| CN-113563529-B | Silane modified polypropylene graft and preparation method and application thereof | 中国石油化工股份有限公司 | 2024-07-02 | — | — | CN | claimed |
| US-20060194067-A1 | Organosiloxane compositions | DOW SILICONES CORPORATION | 2006-08-31 | — | — | US | claimed |
| EP-0854507-B1 | Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same | SHARP KK (JP) | 2006-06-07 | — | — | EP | claimed |
| EP-1620491-A1 | MOISTURE CURABLE ORGANOSILOXANE COMPOSITIONS | Dow Corning Corporation (US) | 2006-02-01 | — | — | EP | claimed |
| WO-2004094503-A1 | MOISTURE CURABLE ORGANOSILOXANE COMPOSITIONS | DOW CORNING CORPORATION (US) | 2004-11-04 | — | — | WO | claimed |
| EP-0787750-B1 | Poly(alkylethylene) structural isomers | BOREALIS GMBH (AT) | 2003-05-14 | — | — | EP | claimed |
| US-6126777-A | AN AQUEOUS ADHESIVE USEFUL FOR BONDING VULCANIZABLE ELASTOMERIC RUBBER TO A SUBSTRATE, MADE FROM ALTEST ONE VINYL GROUP CONTAINING SILANE COMPOUND AND A POLYISOCYANATE; VULCANIZABLE; CURING; INCREASED SHELF-LIFE | LORD CORPORATION (US) | 2000-10-03 | — | — | US | claimed |
| EP-0854507-A2 | Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same | SHARP KABUSHIKI KAISHA (JP) | 1998-07-22 | — | — | EP | claimed |
| US-5767301-A | COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION | SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) | 1998-06-16 | — | — | US | claimed |
| EP-0477765-A2 | Thermoplastic, coupled barrier composites | THE B.F. GOODRICH COMPANY (US) | 1992-04-01 | — | — | EP | claimed |
| US-4793862-A | Silica-based antimony containing film-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1988-12-27 | — | — | US | claimed |