SCHEMBL2247641

SCHEMBL2247641

C=C[Si](CC)(OCCC)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22661026 0.98
SCHEMBL22654225 0.93
SCHEMBL22654147 0.89
SCHEMBL4073826 0.86
SCHEMBL2247499 0.86 TSHR (0.38)
SCHEMBL931781 0.85
SCHEMBL930713 0.85
SCHEMBL22654306 0.84 TSHR (0.34)
SCHEMBL2240707 0.83
SCHEMBL930966 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103626914-A Pour point and viscosity reducing agent and preparation method thereof PETROCHINA CO LTD 2014-03-12 CN claimed
CN-116234874-B Curable composition 株式会社钟化 2024-07-19 CN disclosed
CN-111919173-B Positive photosensitive resin composition, cured film thereof, and solid-state imaging device provided with cured film 东丽株式会社 2024-04-02 CN disclosed
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-11789363-B2 Positive photosensitive resin composition, cured film therefrom, and solid state image sensor comprising the same TORAY INDUSTRIES, INC. (JP) 2023-10-17 US disclosed
CN-116234874-A Curable composition 株式会社钟化 2023-06-06 CN disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
WO-2022075386-A1 CURABLE COMPOSITION 株式会社カネカ 2022-04-14 WO disclosed
CN-1914252-A Vinyl-urethane copolymer and process for producing the same KONISHI CO LTD (JP) 2007-02-14 CN disclosed
US-7005532-B2 Process of producing alkoxysilanes TOAGOSEI CO., LTD. (JP) 2006-02-28 US disclosed
US-20050020845-A1 Process of producing alkoxysilanes TOAGOSEI CO., LTD. (JP) 2005-01-27 US disclosed
US-20040147674-A1 Thermoplastic resin composition KANEKA CORPORATION (JP) 2004-07-29 US disclosed
CN-1509318-A Thermoplastic resin composition ��Ԩ��ѧ��ҵ��ʽ���� 2004-06-30 CN disclosed
EP-1428828-A1 PROCESS FOR PREPARATION OF ALKOXYSILANES TOAGOSEI CO., LTD. (JP) 2004-06-16 EP disclosed
US-20040082705-A1 One-pot water-resistant polyvinyl acetate copolymer aqueous emulsion and it preparation CHANG CHUN PETROCHEMICAL CO., LTD. (TW) 2004-04-29 US disclosed
US-20040082706-A1 Water resistant polyvinyl acetate aqueous emulsion for applying to wood material CHANG CHUN PETROCHEMICAL CO., LTD. (TW) 2004-04-29 US disclosed
EP-1398353-A1 THERMOPLASTIC RESIN COMPOSITION Kaneka Corporation (JP) 2004-03-17 EP disclosed
US-4026826-A ALKOXYSILANES JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JA) 1977-05-31 US disclosed