SCHEMBL20550337

SCHEMBL20550337

C[SiH](C)OCC1CCCC1

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CTSL P07711 1/20 0.32
CTSB P07858 1/20 0.32
CTSK P43235 1/20 0.32
LMNA P02545 1/20 0.32
CYP1A2 P05177 1/20 0.32
SLC1A3 P43003 1/20 0.31
SLC1A2 P43004 1/20 0.31
SLC1A1 P43005 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3893870 0.97 CYP1A2 (0.36) CTSLCTSBCTSKLMNACYP1A2
SCHEMBL29274327 0.89
SCHEMBL10569682 0.89
SCHEMBL28662552 0.73 CYP1A2 (0.38) CTSLCTSBCTSKLMNACYP1A2
SCHEMBL7172540 0.73 CTSL (0.33) CTSLCTSBCTSKLMNACYP1A2
SCHEMBL5400759 0.73 CYP1A2 (0.43) CYP1A2
SCHEMBL28595315 0.72 CTSL (0.31) CTSLCTSBCTSKLMNA
SCHEMBL6356808 0.72 SLC1A3 (0.36) CTSLCTSBCTSKLMNASLC1A3
SCHEMBL3010458 0.70 CYP1A2 (0.31) CYP1A2
SCHEMBL1703244 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4320286-A1 NEW PRECURSORS FOR DEPOSITING FILMS WITH HIGH ELASTIC MODULUS Versum Materials US, LLC (US) 2024-02-14 EP claimed
WO-2022245742-A1 NEW PRECURSORS FOR DEPOSITING FILMS WITH HIGH ELASTIC MODULUS VERSUM MATERIALS US, LLC (US) 2022-11-24 WO claimed
CN-120157702-A Precursor for forming silicon-containing film having high hardness and low dielectric constant and method for manufacturing silicon-containing film using the same EGTM有限公司 2025-06-17 CN disclosed
US-20240240309-A1 New Precursors For Depositing Films With High Elastic Modulus VERSUM MATERIALS US, LLC 2024-07-18 US disclosed
US-20240240309-A1 New Precursors For Depositing Films With High Elastic Modulus VERSUM MATERIALS US, LLC 2024-07-18 US disclosed
US-10461232-B2 Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same CITIZEN WATCH CO., LTD. (JP) 2019-10-29 US disclosed
US-20180323355-A1 CONDENSATION REACTION-TYPE DIE BONDING AGENT, LED LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME CITIZEN WATCH CO., LTD. (JP) 2018-11-08 US disclosed