SCHEMBL2056129

SCHEMBL2056129

CCc1nnnn1CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14727991 0.81
SCHEMBL18031185 0.81
SCHEMBL13327697 0.81
SCHEMBL4403621 0.81 ALDH1A1 (0.44)
SCHEMBL13327698 0.81
SCHEMBL4408138 0.81 ALDH1A1 (0.45)
SCHEMBL4406689 0.79 ALDH1A1 (0.44)
SCHEMBL13252477 0.78 KMT2A (0.36)
SCHEMBL4405716 0.78 ALDH1A1 (0.42)
SCHEMBL96932 0.78 KMT2A (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114032548-A Copper foil etching solution for printed circuit board 河南慧泽生物工程有限公司 2022-02-11 CN claimed
CN-113079628-A Processing method of resistance copper foil material for mobile phone vibration motor PCB 东莞市科佳电路有限公司 2021-07-06 CN claimed
CN-104651840-B Etching composition and the manufacture method for having used its printed circuit board (PCB) 三菱瓦斯化学株式会社 2018-05-01 CN claimed
CN-104120427-B The processing method of wiring substrate and the wiring substrate manufactured using this method 三菱瓦斯化学株式会社 2017-11-28 CN claimed
CN-103510089-B Liquid composition for etching and preparing method of multilayer printed wiring board using same 三菱瓦斯化学株式会社 2017-04-12 CN claimed
US-9394616-B2 Etching composition and method for producing printed-wiring board using the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-07-19 US claimed
US-9301399-B2 Method of treating wiring substrate and wiring substrate manufactured by the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-03-29 US claimed
US-20150144591-A1 ETCHING COMPOSITION AND METHOD FOR PRODUCING PRINTED-WIRING BOARD USING THE SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-05-28 US claimed
CN-104651840-A Etching composition and method for producing printed-wiring board using the same MITSUBISHI GAS CHEMICAL CO 2015-05-27 CN claimed
US-20140311778-A1 METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED BY THE SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-10-23 US claimed
CN-103510089-A Liquid composition for etching and preparing method of multilayer printed wiring board using same MITSUBISHI GAS CHEMICAL CO 2014-01-15 CN claimed
CN-114032548-A Copper foil etching solution for printed circuit board 河南慧泽生物工程有限公司 2022-02-11 CN disclosed
CN-113079628-A Processing method of resistance copper foil material for mobile phone vibration motor PCB 东莞市科佳电路有限公司 2021-07-06 CN disclosed
WO-2021055376-A1 IL-17A MODULATORS AND USES THEREOF DICE ALPHA, INC. (US) 2021-03-25 WO disclosed
CN-104651840-B Etching composition and the manufacture method for having used its printed circuit board (PCB) 三菱瓦斯化学株式会社 2018-05-01 CN disclosed
US-20070179173-A1 Carbostyril compound OTSUKA PHARMACEUTICAL CO., LTD. (JP) 2007-08-02 US disclosed
US-20070179173-A1 Carbostyril compound OTSUKA PHARMACEUTICAL CO., LTD. (JP) 2007-08-02 US disclosed
US-7169800-B2 Imidazole compositions useful as inhibitors of protein kinases VERTEX PHARMACEUTICALS INCORPORATED (US) 2007-01-30 US disclosed
EP-0230783-B1 DIESEL FUEL CONTAINING A TETRAZOLE OR TRIAZOLE CETANE IMPROVER EXXON CHEMICAL PATENTS INC. (US) 1990-01-03 EP disclosed
US-4632674-A Diesel fuel containing a tetrazole or triazole cetane improver EXXON CHEMICAL PATENTS INC. (US) 1986-12-30 US disclosed