Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30127737 | 0.91 | TDP1 (0.47) | TDP1SMN1; SMN2LMNAALDH1A1TSHR | |
| SCHEMBL2058560 | 0.90 | TDP1 (0.41) | TDP1SMN1; SMN2ALDH1A1TSHR | |
| SCHEMBL672598 | 0.86 | TDP1 (0.53) | TDP1SMN1; SMN2LMNAALDH1A1TSHR | |
| SCHEMBL26778912 | 0.84 | LMNA (0.62) | SMN1; SMN2LMNAALDH1A1TSHRHSD17B10 | |
| SCHEMBL16147964 | 0.83 | LMNA (0.33) | TDP1LMNAALDH1A1TSHRHSD17B10 | |
| SCHEMBL8940818 | 0.83 | LMNA (0.33) | TDP1LMNAALDH1A1TSHRHSD17B10 | |
| SCHEMBL22444517 | 0.83 | TDP1 (0.50) | TDP1SMN1; SMN2LMNAALDH1A1TSHR | |
| SCHEMBL8673529 | 0.83 | TDP1 (0.50) | TDP1SMN1; SMN2LMNAALDH1A1TSHR | |
| SCHEMBL22444464 | 0.83 | TDP1 (0.50) | TDP1SMN1; SMN2LMNAALDH1A1TSHR | |
| SCHEMBL22444525 | 0.83 | TDP1 (0.50) | TDP1SMN1; SMN2LMNAALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3004429-B1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | ROHM & HAAS ELECT MAT (US) | 2018-07-18 | — | — | EP | claimed |
| EP-3816325-B1 | ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2025-05-07 | — | — | EP | disclosed |
| CN-110176441-B | Copper pillars with improved integrity and method of making same | 罗门哈斯电子材料有限责任公司 | 2023-08-01 | — | — | CN | disclosed |
| EP-4098778-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2022-12-07 | — | — | EP | disclosed |
| US-11434577-B2 | Acid aqueous binary silver-bismuth alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2022-09-06 | — | — | US | disclosed |
| EP-3816326-B1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | ROHM & HAAS ELECT MAT (US) | 2022-06-29 | — | — | EP | disclosed |
| US-20220112619-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2022-04-14 | — | — | US | disclosed |
| US-11242609-B2 | Acidic aqueous silver-nickel alloy electroplating compositions and methods | Rohm and Hass Electronic Materials LLC (US) | 2022-02-08 | — | — | US | disclosed |
| EP-3835459-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2021-06-16 | — | — | EP | disclosed |
| CN-112941578-A | Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods | 罗门哈斯电子材料有限责任公司 | 2021-06-11 | — | — | CN | disclosed |
| EP-2910667-B1 | CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS | ROHM & HAAS ELECT MAT (US) | 2016-04-27 | — | — | EP | disclosed |
| EP-3004429-A1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | Rohm and Haas Electronic Materials LLC (US) | 2016-04-13 | — | — | EP | disclosed |
| EP-3002350-A1 | CYANIDE-FREE ELECTROPLATING BATHS FOR WHITE BRONZE BASED ON COPPER (I) IONS | Rohm and Haas Electronic Materials LLC (US) | 2016-04-06 | — | — | EP | disclosed |
| US-20150240375-A1 | CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-08-27 | — | — | US | disclosed |
| EP-2910667-A1 | CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| WO-2014165867-A1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-10-09 | — | — | WO | disclosed |
| US-7968444-B2 | Lead-free tin alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-06-28 | — | — | US | disclosed |
| US-20100216302-A1 | Lead-free tin alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2010-08-26 | — | — | US | disclosed |
| EP-2221396-A1 | Lead-Free Tin Alloy Electroplating Compositions and Methods | Rohm and Haas Electronic Materials LLC (US) | 2010-08-25 | — | — | EP | disclosed |
| US-5162585-A | Preparation of dihydroxy bis-sulfides | PHILLIPS PETROLEUM COMPANY (US) | 1992-11-10 | — | — | US | disclosed |