SCHEMBL2058706

SCHEMBL2058706

CCCCC=C[SiH](C)C1(C2([SiH](C)C)CCCCO2)CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853229 0.94 FAAH (0.30)
SCHEMBL9331849 0.94 FAAH (0.30)
SCHEMBL8750953 0.91
SCHEMBL28095191 0.85
SCHEMBL27552733 0.78
SCHEMBL4814454 0.74
SCHEMBL29084584 0.72
SCHEMBL8045423 0.72 SCN2A (0.31)
SCHEMBL4739966 0.72 SCN2A (0.31)
SCHEMBL21066174 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0860487-B1 Silicone release coating compositions DOW CORNING ASIA LTD (JP) 2000-07-12 EP claimed
US-5945475-A Silicone release coating compositions DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-08-31 US claimed
EP-0845511-A2 Silicone release coating compositions Dow Corning Toray Silicone Company, Ltd. (JP) 1998-06-03 EP claimed
US-5370936-A Low temperature curing DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-12-06 US claimed
WO-2026100708-A1 PHOTOSENSITIVE RESIN LAMINATE, PHOTOSENSITIVE ELEMENT, AND PATTERN FORMING METHOD 旭化成株式会社 2026-05-15 WO disclosed
WO-2025005146-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND LIKE 旭化成株式会社 2025-01-02 WO disclosed
WO-2024185632-A1 RELEASE FILM, METHOD FOR MANUFACTURING SAME, AND FILM LAMINATE 東レフィルム加工株式会社 2024-09-12 WO disclosed
US-12076913-B2 Feed material for three-dimensional printing containing a polyoxymethylene polymer TICONA LLC (US) 2024-09-03 US disclosed
CN-118541643-A Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern 旭化成株式会社 2024-08-23 CN disclosed
WO-2024085254-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MULTILAYER BODY, AND METHOD FOR FORMING RESIST PATTERN 旭化成株式会社 2024-04-25 WO disclosed
US-20230405408-A1 BUOYANT HIGH COEFFICIENT OF RESTITUTION (CoR) GOLF BALL INCORPORATING AERODYNAMICS TARGETING FLIGHT TRAJECTORY ACUSHNET COMPANY (US) 2023-12-21 US disclosed
EP-3559132-B1 POLYORGANOSILOXANE RELEASE COATING AND METHOD FOR ITS PREPARATION AND USE DOW SHANGHAI HOLDING CO LTD (CN) 2023-11-15 EP disclosed
US-5328941-A Blend of polysiloxanes containing alkenyl groups and mercaptoalkyl groups DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-07-12 US disclosed
EP-0371405-B1 Organopolysiloxane composition for the formation of a release film DOW CORNING TORAY SILICONE (JP) 1994-04-06 EP disclosed
EP-0581285-A1 Organopolysiloxane composition for the formation of cured release films Dow Corning Toray Silicone Company, Limited (JP) 1994-02-02 EP disclosed
US-5264499-A Polysiloxanes copolymers with unsaturated siloxane cured monomers for laminated paper DOW CORNING TORAY SILICONE CO. LTD. (JP) 1993-11-23 US disclosed
EP-0548860-A1 Organopolysiloxane composition for the formation of a cured release film Dow Corning Toray Silicone Company, Limited (JP) 1993-06-30 EP disclosed
US-5145932-A ORGANOPOLYSILOXANE COMPOSITION FOR THE FORMATION OF A RELEASE FILM TORAY SILICONE COMPANY, LTD. (JP) 1992-09-08 US disclosed
US-5064916-A Higher Alkenyl Groups TORAY SILICONE COMPANY, LTD. (JP) 1991-11-12 US disclosed
EP-0371404-A2 Organopolysiloxane composition for the formation of a cured release film Dow Corning Toray Silicone Company Ltd. (JP) 1990-06-06 EP disclosed