SCHEMBL2063579

SCHEMBL2063579

C=C(CC)CCCCCCCCCCCCCCCCCCCCCC

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 3/20 0.48
CES1 P23141 3/20 0.48
GPR84 Q9NQS5 7/20 0.46
PPARG P37231 7/20 0.46
PPARD Q03181 7/20 0.46
PPARA Q07869 7/20 0.46
HDAC11 Q96DB2 5/20 0.46
TSHR P16473 5/20 0.46
PTPN1 P18031 3/20 0.46
ALDH1A1 P00352 2/20 0.46
TLR2 O60603 2/20 0.46
TDP1 Q9NUW8 2/20 0.46
FABP4 P15090 2/20 0.46
SLC22A6 Q4U2R8 1/20 0.46
SLC22A8 Q8TCC7 1/20 0.46
MEN1 O00255 1/20 0.46
ESR1 P03372 1/20 0.46
ALOX15 P16050 1/20 0.46
PDE4A P27815 1/20 0.46
KMT2A Q03164 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9015946 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL10995199 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL9015912 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL9015944 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL73572 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL6552083 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL9015857 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL9015920 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL11065619 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD
SCHEMBL4300172 1.00 CES2 (0.48) CES2CES1GPR84PPARGPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8147742-B2 Lithography processes using phase change compositions DOW CORNING CORPORATION (US) 2012-04-03 US disclosed
EP-1807734-B1 LITHOGRAPHY PROCESSES USING PHASE CHANGE COMPOSITIONS DOW CORNING (US) 2011-11-09 EP disclosed
US-20070290387-A1 Lithography Processes Using Phase Change Compositions DOW CORNING CORPORATION 2007-12-20 US disclosed
EP-1807734-A2 LITHOGRAPHY PROCESSES USING PHASE CHANGE COMPOSITIONS Dow Corning Corporation (US) 2007-07-18 EP disclosed
US-7074490-B2 Matrix comprising an organofunctional silicone wax, and a thermally conductive filler. DOW CORNING CORPORATION (US) 2006-07-11 US disclosed
WO-2006041645-A2 LITHOGRAPHY PROCESSES USING PHASE CHANGE COMPOSITIONS DOW CORNING CORPORATION (US) 2006-04-20 WO disclosed
US-20030224186-A1 Matrix comprising an organofunctional silicone wax, and a thermally conductive filler. DOW CORNING CORPORATION 2003-12-04 US disclosed
US-6620515-B2 Comprising an organofunctional silicone wax and a thermally conductive filler; can be used as a thermal interface material DOW CORNING CORPORATION 2003-09-16 US disclosed
WO-2003052818-A1 THERMALLY CONDUCTIVE PHASE CHANGE MATERIALS DOW CORNING CORPORATION (US) 2003-06-26 WO disclosed
US-20030113556-A1 Organofunctional silicone wax; conductive filler; interface material for an electronic component having a heat sink DOW CORNING CORPORATION 2003-06-19 US disclosed