SCHEMBL20643267

SCHEMBL20643267

CC1(O)COC(O)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL859679 0.75 — —
SCHEMBL12286847 0.75 — —
SCHEMBL18696906 0.73 — —
SCHEMBL12187157 0.69 — —
SCHEMBL44598 0.67 — —
SCHEMBL16149753 0.67 — —
SCHEMBL2598251 0.65 — —
SCHEMBL13577716 0.65 — —
SCHEMBL8006184 0.65 — —
SCHEMBL18346705 0.64 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220179306-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-09 — — US disclosed
US-10976661-B2 Resist composition, method of forming resist pattern, and polymer compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-04-13 — — US disclosed
US-20200150531-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-14 — — US disclosed
US-20190018319-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMER COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2019-01-17 — — US disclosed
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