⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Silicate SCHEMBL4565145 | 1.00 | — | — | |
| Silicate SCHEMBL33511 | 1.00 | — | — | |
| Silicate SCHEMBL2122358 | 0.94 | — | — | |
| Silicate SCHEMBL20473414 | 0.94 | — | — | |
| Silicate SCHEMBL11497419 | 0.94 | — | — | |
| Silicate SCHEMBL5445947 | 0.94 | — | — | |
| Silicate SCHEMBL238035 | 0.94 | — | — | |
| Silicate SCHEMBL2471027 | 0.94 | — | — | |
| Silicate SCHEMBL22273598 | 0.94 | — | — | |
| Silicate SCHEMBL11059236 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115785400-A | Latent accelerator capable of reducing curing stress of epoxy resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-14 | — | — | CN | claimed |
| US-20090234080-A1 | PROCESS FOR PRODUCING LATENT CATALYST AND EPOXY RESIN COMPOSITION | SUMITOMO DAKELITE CO., LTD. (JP) | 2009-09-17 | — | — | US | claimed |
| CN-121064467-A | Latent accelerator capable of reducing epoxy resin curing stress and preparation method and application thereof | 中国科学院化学研究所 | 2025-12-05 | — | — | CN | disclosed |
| CN-115785400-B | Latent accelerator capable of reducing epoxy resin curing stress and preparation method and application thereof | 中国科学院化学研究所 | 2025-07-04 | — | — | CN | disclosed |
| CN-114805754-B | Latent catalyst for semiconductor packaging material and preparation method thereof | 衡所华威电子有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-115785400-A | Latent accelerator capable of reducing curing stress of epoxy resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-14 | — | — | CN | disclosed |
| CN-115785400-A | Latent accelerator capable of reducing curing stress of epoxy resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-14 | — | — | CN | disclosed |
| CN-114805754-A | Latent catalyst for semiconductor packaging material and preparation method thereof | 衡所华威电子有限公司 | 2022-07-29 | — | — | CN | disclosed |
| US-8987355-B2 | Epoxy resin composition for sealing, and electronic component device | SUMITOMO BAKELITE CO., LTD. (JP) | 2015-03-24 | — | — | US | disclosed |
| US-20130277867-A1 | EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-10-24 | — | — | US | disclosed |
| CN-103328531-A | Epoxy resin composition for sealing, and electronic component device | SUMITOMO BAKELITE CO | 2013-09-25 | — | — | CN | disclosed |
| JP-2007246671-A | MANUFACTURING METHOD OF LATENT CATALYST AND EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 2007-09-27 | — | — | JP | disclosed |
| JP-2007119710-A | METHOD FOR PRODUCING LATENT CATALYST AND EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 2007-05-17 | — | — | JP | disclosed |
| WO-2007037024-A1 | PROCESS FOR PRODUCING LATENT CATALYST AND EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2007-04-05 | — | — | WO | disclosed |
| US-20070010601-A1 | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device | SUMOTOMO BAKELITE COMPANY LIMITED (JP) | 2007-01-11 | — | — | US | disclosed |
| US-20060189721-A1 | retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering | SUMITOMO BAKELITE CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| US-6998437-B2 | Preparation of polydiorganosiloxanes | WACKER-CHEMIE GMBH (DE) | 2006-02-14 | — | — | US | disclosed |
| US-20050075474-A1 | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20030229193-A1 | Preparation of polydiorganosiloxanes | WACKER-CHEMIE GMBH (DE) | 2003-12-11 | — | — | US | disclosed |
| US-3983289-A | EPOXIDIZED ALKADIENE ALCOHOL ESTER OF POLYCARBOXYLIC ACID, B-STAGE RESIN | MITSUBISHI CHEMICAL INDUSTRIES LTD. (JA) | 1976-09-28 | — | — | US | disclosed |