Resorcinol

Resorcinol

SCHEMBL20768375

Cc1cccc(C)c1OP(=O)(Oc1c(C)cccc1C)OP(=O)(O)O.Oc1cccc(O)c1

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SRC P12931 1/20 0.38
ALDH1A1 P00352 3/20 0.38
LMNA P02545 3/20 0.38
CYP3A4 P08684 2/20 0.38
CA12 O43570 1/20 0.38
CA2 P00918 1/20 0.38
CA5A P35218 1/20 0.38
CA9 Q16790 1/20 0.38
HSD17B10 Q99714 1/20 0.38
CA14 Q9ULX7 1/20 0.38
CA5B Q9Y2D0 1/20 0.38
ACHE P22303 1/20 0.36
INPPL1 O15357 1/20 0.36
INPP5B P32019 1/20 0.36
INPP5A Q14642 1/20 0.36
MMP1 P03956 1/20 0.33
MMP2 P08253 1/20 0.33
MMP9 P14780 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2C19 P33261 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Resorcinol SCHEMBL14939224 0.92 CYP3A4 (0.41) SRCALDH1A1LMNACYP3A4CA12
SCHEMBL2571511 0.90 INPPL1 (0.42) SRCALDH1A1LMNAHSD17B10INPPL1
Resorcinol SCHEMBL20361676 0.88 SRC (0.41) SRCALDH1A1LMNACYP3A4CA12
Resorcinol SCHEMBL1458397 0.87 SRC (0.50) SRCALDH1A1LMNACYP3A4CA12
SCHEMBL16594618 0.85 CYP3A4 (0.40) SRCLMNACYP3A4INPPL1INPP5B
Resorcinol SCHEMBL28540177 0.84 ALDH1A1 (0.40) SRCALDH1A1LMNACYP3A4CA12
Resorcinol SCHEMBL1013060 0.83 CYP3A4 (0.43) SRCALDH1A1LMNACYP3A4CA12
Hydroquinone SCHEMBL9718342 0.82 SCN8A (0.39) ALDH1A1LMNAHSD17B10INPPL1INPP5B
Pyrophosphoric Acid SCHEMBL28395595 0.80 ALDH1A1 (0.50) ALDH1A1LMNACYP3A4CA12CA2
SCHEMBL15380739 0.80 INPPL1 (0.35) SRCALDH1A1LMNAHSD17B10INPPL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230242691-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT DIC CORPORATION (JP) 2023-08-03 US disclosed
US-11643544-B2 Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-05-09 US disclosed
US-10994516-B2 Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-05-04 US disclosed
US-20190241733-A1 RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2019-08-08 US disclosed
US-20190071548-A1 RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2019-03-07 US disclosed