Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 2/20 | 0.41 |
| ▸ | HPGD | P15428 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | CES2 | O00748 | 1/20 | 0.39 |
| ▸ | CES1 | P23141 | 1/20 | 0.39 |
| ▸ | ADH1B | P00325 | 1/20 | 0.36 |
| ▸ | ADH1C | P00326 | 1/20 | 0.36 |
| ▸ | ADH1A | P07327 | 1/20 | 0.36 |
| ▸ | ADH4 | P08319 | 1/20 | 0.36 |
| ▸ | ADH7 | P40394 | 1/20 | 0.36 |
| ▸ | MGLL | Q99685 | 1/20 | 0.35 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.34 |
| ▸ | CHRM5 | P08912 | 2/20 | 0.33 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.33 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.33 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.33 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.33 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15911093 | 0.92 | EPHX1 (0.33) | EPHX1HPGDKMT2AADH1BADH1C | |
| SCHEMBL16530315 | 0.86 | EPHX1 (0.33) | EPHX1HPGDKMT2AADH1BADH1C | |
| SCHEMBL15911064 | 0.79 | PLG (0.35) | — | |
| SCHEMBL6388427 | 0.78 | EPHX1 (0.41) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL3635971 | 0.76 | EPHX1 (0.40) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL11503387 | 0.74 | EPHX1 (0.39) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL1936361 | 0.74 | EPHX1 (0.39) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL11402454 | 0.74 | EPHX1 (0.39) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL5460780 | 0.74 | EPHX1 (0.39) | EPHX1HPGDKMT2ACES2CES1 | |
| SCHEMBL4224634 | 0.70 | CYP1A2 (0.38) | EPHX1HPGDKMT2ACES2CES1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117659991-A | Multilayer-coated perovskite quantum dot material, and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-03-08 | — | — | CN | claimed |
| CN-118263381-A | Full-color Micro LED Micro-lens array display device and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-06-28 | — | — | CN | disclosed |
| CN-118159605-A | Resin composition, prepreg, laminated board, metal-clad laminated board, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2024-06-07 | — | — | CN | disclosed |
| CN-117659991-A | Multilayer-coated perovskite quantum dot material, and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-03-08 | — | — | CN | disclosed |
| US-11691389-B2 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | RESONAC CORPORATION (JP) | 2023-07-04 | — | — | US | disclosed |
| WO-2023074886-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| CN-115835956-A | Laminate board, printed circuit board, semiconductor package, and method for manufacturing laminate board | 昭和电工材料株式会社 | 2023-03-21 | — | — | CN | disclosed |
| EP-3456779-B1 | PREPREG, METAL FOIL WITH RESIN, LAMINATE AND PRINTED WIRING BOARD | SHOWA DENKO MATERIALS CO LTD (JP) | 2023-03-01 | — | — | EP | disclosed |
| CN-115703932-A | Preparation method and application of double-layer coated perovskite quantum dot/polymer | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2023-02-17 | — | — | CN | disclosed |
| CN-109153837-B | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | 昭和电工材料株式会社 | 2022-08-05 | — | — | CN | disclosed |
| WO-2021256516-A1 | LAMINATED BOARD, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LAMINATED BOARD | 昭和電工マテリアルズ株式会社 | 2021-12-23 | — | — | WO | disclosed |
| US-20210079172-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | SHOWA DENKO MATERIALS CO., LTD. | 2021-03-18 | — | — | US | disclosed |
| US-20190161586-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| EP-3456779-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-03-20 | — | — | EP | disclosed |