Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9730284 | 0.88 | TSHR (0.41) | TSHRLMNA | |
| SCHEMBL16924994 | 0.83 | TSHR (0.33) | TSHRLMNATDP1 | |
| SCHEMBL5955083 | 0.82 | TSHR (0.41) | TSHRLMNA | |
| SCHEMBL9011656 | 0.82 | TSHR (0.36) | TSHR | |
| SCHEMBL10181433 | 0.82 | TSHR (0.36) | TSHRTDP1 | |
| SCHEMBL139085 | 0.79 | — | — | |
| SCHEMBL19522171 | 0.78 | TSHR (0.33) | TSHRLMNATDP1 | |
| SCHEMBL21391581 | 0.78 | TSHR (0.33) | TSHRLMNATDP1 | |
| SCHEMBL29214720 | 0.77 | — | — | |
| SCHEMBL9730228 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118727074-B | Densification agent for improving grain fineness of tin plating layer, tin plating electrolyte prepared by densification agent and preparation method of tin plating electrolyte | 中山市康迪斯威科技有限公司 | 2025-01-28 | — | — | CN | disclosed |
| CN-117187792-B | Aluminum alloy high-phosphorus chemical nickel precipitation liquid and use method and application thereof | 中山博美新材料科技有限公司 | 2024-07-09 | — | — | CN | disclosed |
| CN-117210888-A | Additive for electroplating solution, lead frame nickel plating electroplating solution and nickel plating process | 宁波埃斯科光电有限公司 | 2023-12-12 | — | — | CN | disclosed |
| CN-117187792-A | Aluminum alloy high-phosphorus chemical nickel precipitation liquid and use method and application thereof | 中山博美新材料科技有限公司 | 2023-12-08 | — | — | CN | disclosed |
| EP-3470475-B1 | CURABLE COMPOSITION FOR COATINGS WITH ANTI-ADHESIVE PROPERTY | EVONIK OPERATIONS GMBH (DE) | 2021-01-27 | — | — | EP | disclosed |
| EP-3470475-A1 | CURABLE COMPOSITION FOR COATINGS WITH ANTI-ADHESIVE PROPERTY | Evonik Degussa GmbH (DE) | 2019-04-17 | — | — | EP | disclosed |