Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GRIK1 | P39086 | 2/20 | 0.54 |
| ▸ | GRIK2 | Q13002 | 1/20 | 0.51 |
| ▸ | EPHX1 | P07099 | 9/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | NAAA | Q02083 | 1/20 | 0.34 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.33 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.33 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.33 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.33 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | PTGES | O14684 | 1/20 | 0.33 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.33 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL322607 | 0.89 | GRIK1 (0.51) | GRIK1GRIK2EPHX1NAAAPTGES | |
| SCHEMBL692340 | 0.89 | GRIK1 (0.51) | GRIK1GRIK2EPHX1NAAAPTGES | |
| SCHEMBL2536866 | 0.88 | GRIK1 (0.50) | GRIK1GRIK2ALDH1A1NAAAPTGES | |
| SCHEMBL1651116 | 0.85 | GRIK1 (0.57) | GRIK1GRIK2EPHX1KDM4EALDH1A1 | |
| SCHEMBL157326 | 0.85 | GRIK1 (0.57) | GRIK1GRIK2EPHX1KDM4EALDH1A1 | |
| SCHEMBL27279087 | 0.84 | GRIK1 (0.45) | GRIK1GRIK2EPHX1KDM4EALDH1A1 | |
| SCHEMBL3853225 | 0.83 | GRIK1 (0.56) | GRIK1GRIK2ALDH1A1 | |
| SCHEMBL990463 | 0.82 | GRIK1 (0.56) | GRIK1GRIK2ALDH1A1FFAR3SMN1; SMN2 | |
| SCHEMBL990464 | 0.82 | GRIK1 (0.56) | GRIK1GRIK2ALDH1A1FFAR3SMN1; SMN2 | |
| SCHEMBL12498813 | 0.82 | GRIK1 (0.56) | GRIK1GRIK2ALDH1A1FFAR3SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8163836-B2 | low hygroscopicity, high alkali resistance, heat resistance of 200 degrees Celcius or higher, and can be easily removed with a stripping liquid; use with semiconductor processing; terpolymer of styrene, an alkyl (meth)acrylate, and a cycloaliphatic (meth)acrylate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-04-24 | — | — | US | disclosed |
| US-7999052-B2 | Process for producing an adhesive composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-20100227996-A1 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-09-09 | — | — | US | disclosed |
| US-20100178497-A1 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20090137760-A1 | ADHESIVE COMPOSITION AND ADHESIVE FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |