⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20957525 | 1.00 | — | — | |
| SCHEMBL13665546 | 1.00 | — | — | |
| SCHEMBL8921008 | 1.00 | — | — | |
| SCHEMBL1010560 | 1.00 | — | — | |
| SCHEMBL13665402 | 1.00 | — | — | |
| SCHEMBL3445935 | 1.00 | — | — | |
| SCHEMBL3444560 | 1.00 | — | — | |
| SCHEMBL20957519 | 1.00 | — | — | |
| SCHEMBL3444274 | 0.96 | — | — | |
| SCHEMBL296261 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111954848-B | Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member | DIC株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-109153653-B | Novel compound, photocurable composition, cured product thereof, printing ink, and printed matter using the printing ink | DIC株式会社 | 2022-06-28 | — | — | CN | disclosed |
| US-11079675-B2 | Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink | DIC CORPORATION (JP) | 2021-08-03 | — | — | US | disclosed |
| CN-111954848-A | Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member | DIC株式会社 | 2020-11-17 | — | — | CN | disclosed |
| WO-2019198490-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER | DIC株式会社 | 2019-10-17 | — | — | WO | disclosed |
| US-20190137872-A1 | NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK | DIC CORPORATION (JP) | 2019-05-09 | — | — | US | disclosed |