SCHEMBL20969282

SCHEMBL20969282

CNc1ccc2nc3cc(C)c(N)cc3[n+](-c3ccccc3)c2c1

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.46
NPC1 O15118 4/20 0.46
MEN1 O00255 4/20 0.46
POLB P06746 3/20 0.46
APAF1 O14727 2/20 0.46
MMP14 P50281 2/20 0.46
BLM P54132 2/20 0.46
CASP6 P55212 2/20 0.46
PABPC1 P11940 1/20 0.46
RAB9A P51151 3/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
NLRP3 Q96P20 1/20 0.44
ALDH1A1 P00352 3/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
GNG2 P59768 1/20 0.41
GNB1 P62873 1/20 0.41
KDM1A O60341 1/20 0.34
EGFR P00533 1/20 0.34
TERT O14746 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL20969312 1.00 KMT2A (0.46) KMT2ANPC1MEN1POLBAPAF1
SCHEMBL20555452 0.89 ALDH1A1 (0.47) KMT2ANPC1MEN1POLBAPAF1
SCHEMBL14281484 0.87 ALDH1A1 (0.46) KMT2ANPC1MEN1RAB9AL3MBTL1
SCHEMBL114128 0.87 NPC1 (0.47) KMT2ANPC1MEN1POLBAPAF1
Hydrochloric Acid SCHEMBL15265 0.87 NPC1 (0.47) KMT2ANPC1MEN1POLBAPAF1
SCHEMBL31680480 0.87 NPC1 (0.47) KMT2ANPC1MEN1POLBAPAF1
Hydrochloric Acid SCHEMBL29353138 0.87 NPC1 (0.47) KMT2ANPC1MEN1POLBAPAF1
SCHEMBL16983736 0.85 NPC1 (0.40) KMT2ANPC1MEN1POLBAPAF1
Hydrochloric Acid SCHEMBL11153458 0.85 NPC1 (0.40) KMT2ANPC1MEN1POLBAPAF1
SCHEMBL20554944 0.84 NPC1 (0.60) KMT2ANPC1MEN1POLBAPAF1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10982343-B2 Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate ATOTECH DEUTSCHLAND GMBH (DE) 2021-04-20 US disclosed
US-20200347504-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-11-05 US disclosed
EP-3483307-B1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-01 EP disclosed
EP-3483307-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH Deutschland GmbH (DE) 2019-05-15 EP disclosed