SCHEMBL2103045

SCHEMBL2103045

CCN(CC)[Si](Cl)(c1ccccc1)N(C)C

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.31
ALDH1A1 P00352 2/20 0.31
TP53 P04637 2/20 0.31
GLA P06280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2101348 0.90 TP53 (0.33) TSHRALDH1A1TP53GLA
SCHEMBL55438 0.83 ESR1 (0.34) TSHRALDH1A1TP53
SCHEMBL11127633 0.77 TSHR (0.34) TSHRALDH1A1TP53GLA
SCHEMBL2100486 0.77 TSHR (0.33) TSHRALDH1A1TP53GLA
SCHEMBL2101359 0.77 TSHR (0.33) TSHRALDH1A1TP53GLA
SCHEMBL2101677 0.75 TSHR (0.33) TSHRALDH1A1TP53GLA
SCHEMBL2101600 0.75 NR1I2 (0.36) TSHRALDH1A1TP53GLA
SCHEMBL2101178 0.75 TSHR (0.33) TSHRALDH1A1TP53GLA
SCHEMBL2102030 0.75 CHRM2 (0.35) TSHRALDH1A1TP53GLA
SCHEMBL2104189 0.73 TSHR (0.31) TSHRALDH1A1TP53GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed