SCHEMBL2103129

SCHEMBL2103129

C1=C(C2=CCCCCC2)CCCCC1.CC[Si](Cl)(Cl)Cl

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PSMB5 P28074 9/20 0.37
TYMP P19971 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
PSMB1 P20618 2/20 0.34
ALDH1A1 P00352 2/20 0.34
CYP3A4 P08684 1/20 0.34
RAB9A P51151 2/20 0.33
NPC1 O15118 1/20 0.33
ELANE P08246 1/20 0.33
JAK2 O60674 2/20 0.33
JAK3 P52333 2/20 0.33
JAK1 P23458 1/20 0.33
CXCR3 P49682 1/20 0.33
PTPN11 Q06124 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL295851 0.90 ALDH1A1 (0.37) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL27912770 0.85 ALDH1A1 (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL12979699 0.81 PSMB5 (0.39) PSMB5ALDH1A1RAB9A
SCHEMBL3233355 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL11201526 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL18244171 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL2105114 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL21057468 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL3502363 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1
SCHEMBL3233362 0.79 TYMP (0.41) PSMB5TYMPTDP1PSMB1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11879029-B2 Polymerizable composition, cycloolefin-based polymer, and metal/resin composite RIMTEC CORPORATION (JP) 2024-01-23 US disclosed
EP-4011613-A1 POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, AND METAL/RESIN COMPOSITE RIMTEC Corporation (JP) 2022-06-15 EP disclosed
WO-2021024956-A1 POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, AND METAL/RESIN COMPOSITE RIMTEC株式会社 2021-02-11 WO disclosed
US-8716364-B2 Surface-coated reinforcing material, fluid composition for reaction injection molding, and article formed by reaction injection molding RIMTEC CORPORATION (JP) 2014-05-06 US disclosed
US-20120259053-A1 SURFACE-COATED REINFORCING MATERIAL, FLUID COMPOSITION FOR REACTION INJECTION MOLDING, AND ARTICLE FORMED BY REACTION INJECTION MOLDING RIMTEC CORPORATION (JP) 2012-10-11 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed