Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | CACNA2D1 | P54289 | 1/20 | 0.32 |
| ▸ | ATM | Q13315 | 1/20 | 0.32 |
| ▸ | NISCH | Q9Y2I1 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2268693 | 0.82 | TSHR (0.48) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL2272263 | 0.77 | TSHR (0.50) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL2101843 | 0.77 | TSHR (0.43) | TSHRKDM4EHTT | |
| SCHEMBL2271141 | 0.74 | TSHR (0.50) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL2103512 | 0.72 | CACNA2D1 (0.33) | TSHRCACNA2D1KDM4E | |
| SCHEMBL2277062 | 0.72 | TSHR (0.52) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL2269777 | 0.70 | TSHR (0.53) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL2101823 | 0.70 | KCNH2 (0.37) | CACNA2D1KDM4E | |
| SCHEMBL994607 | 0.68 | TSHR (0.73) | TSHRATMNISCHKDM4EHTT | |
| SCHEMBL29066958 | 0.67 | TSHR (0.50) | TSHRATMNISCHKDM4EHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |