SCHEMBL21044673

SCHEMBL21044673

CCCCCCCCCCCCCCCCCCCCCCCCCCCCOC(=O)CC

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 1.00
RAD52 P43351 1/20 0.62
NPSR1 Q6W5P4 1/20 0.62
DGKA P23743 1/20 0.61
FAAH O00519 2/20 0.60
HTR2C P28335 1/20 0.58
EPHX1 P07099 1/20 0.57
TSHR P16473 3/20 0.55
DNM1 Q05193 1/20 0.55
HTT P42858 1/20 0.53
HCAR2 Q8TDS4 1/20 0.52
PRSS1 P07477 1/20 0.51
PRSS2 P07478 1/20 0.51
PRSS3 P35030 1/20 0.51
ALDH1A1 P00352 1/20 0.50
ACHE P22303 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1056018 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL4827855 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL545172 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL5436011 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL21044637 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL9335976 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL1471551 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL112452 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL127979 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH
SCHEMBL1695319 1.00 NAAA (1.00) NAAARAD52NPSR1DGKAFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115667599-B Heat storage composition 住友化学株式会社 2026-05-12 CN disclosed
EP-3492526-B1 RESIN COMPOSITION AND USE THEREOF SUMITOMO CHEMICAL CO (JP) 2025-02-19 EP disclosed
CN-117321172-A Heat storage composition 住友化学株式会社 2023-12-29 CN disclosed
US-20190270923-A1 RESIN COMPOSITION AND USE THEREOF SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2019-09-05 US disclosed
EP-3492526-A1 RESIN COMPOSITION AND USE THEREOF Sumitomo Chemical Company Limited (JP) 2019-06-05 EP disclosed