⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL8379012 | 0.73 | CTSD (0.30) | — | |
| SCHEMBL28265464 | 0.72 | CTSD (0.32) | — | |
| SCHEMBL8853537 | 0.70 | CTSD (0.31) | — | |
| SCHEMBL27894201 | 0.70 | CTSD (0.31) | — | |
| Hydrochloric Acid SCHEMBL8382426 | 0.70 | CTSD (0.32) | — | |
| SCHEMBL6856807 | 0.70 | — | — | |
| Hydrochloric Acid SCHEMBL8846337 | 0.68 | CTSD (0.30) | — | |
| Methylene Chloride SCHEMBL8847111 | 0.68 | CTSD (0.30) | — | |
| Hydrochloric Acid SCHEMBL5888449 | 0.68 | CTSD (0.30) | — | |
| Hydrochloric Acid SCHEMBL5888446 | 0.68 | CTSD (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-3492982-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| EP-3492982-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |