SCHEMBL21066100

SCHEMBL21066100

C[Si](C)(CCCOCCCOCC[Si](C)(C)O[Si](C)(C)C1CC2CC1C1C(=O)OC(=O)C21)O[Si](C)(C)C1CC2CC1C1C(=O)OC(=O)C21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21066079 0.98
SCHEMBL21101828 0.98
SCHEMBL21066080 0.95
SCHEMBL21066099 0.95
SCHEMBL21066081 0.85
SCHEMBL6661239 0.82 KDM4E (0.34)
SCHEMBL18031714 0.82
SCHEMBL2719986 0.77 KDM4E (0.32)
SCHEMBL14286668 0.75
SCHEMBL15235662 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10919918-B2 Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-02-16 US disclosed
US-20190169211-A1 NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-06-06 US disclosed