SCHEMBL2719986

SCHEMBL2719986

C[Si](C)(O[Si](C)(C)C1CC2CC1C1C(=O)OC(=O)C21)O[Si](C)(C)C1CC2CC1C1C(=O)OC(=O)C21

nearest known ligand 0.32

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.32
GMNN O75496 1/20 0.32
PPM1B O75688 1/20 0.32
LMNA P02545 1/20 0.32
PPP1CC P36873 1/20 0.32
TFPI2 P48307 1/20 0.32
RAB9A P51151 1/20 0.32
PPP5C P53041 1/20 0.32
PPP1CA P62136 1/20 0.32
PMP22 Q01453 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
TP53 P04637 1/20 0.32
CYP2D6 P10635 1/20 0.32
NFKB1 P19838 1/20 0.32
THPO P40225 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6661239 0.93 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL15033323 0.92
SCHEMBL18031714 0.88
SCHEMBL15021248 0.87
SCHEMBL3795211 0.87
SCHEMBL15021861 0.87
SCHEMBL15224171 0.86
SCHEMBL14286668 0.85
SCHEMBL15235662 0.85
SCHEMBL15033321 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773222-B2 Curable composition and electronic device employing the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2023-10-03 US disclosed
US-8673537-B2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-18 US disclosed
US-8524921-B2 Liquid tetracarboxylic dianhydrides and process for the preparation thereof HITACHI CHEMICAL CO., LTD. (JP) 2013-09-03 US disclosed
US-8524921-B2 Liquid tetracarboxylic dianhydrides and process for the preparation thereof HITACHI CHEMICAL CO., LTD. (JP) 2013-09-03 US disclosed
US-20130158225-A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME RESONAC CORPORATION (JP) 2013-06-20 US disclosed
US-20130158225-A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME RESONAC CORPORATION (JP) 2013-06-20 US disclosed
EP-1697441-B1 NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION MOMENTIVE PERFORMANCE MAT INC (US) 2012-05-02 EP disclosed
US-20110301362-A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-12-08 US disclosed
US-20110301362-A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-12-08 US disclosed
US-20110143103-A1 PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-06-16 US disclosed
EP-1697441-A1 NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION General Electric Company, (a New York Corporation) (US) 2006-09-06 EP disclosed
EP-1697985-A1 COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEREOF GENERAL ELECTRIC COMPANY (US) 2006-09-06 EP disclosed
US-20060147719-A1 Curable epoxy composition with colloidal silica and phenolic resins on substrates MOMENTIVE PERFORMANCE MATERIALS INC. 2006-07-06 US disclosed
US-7022410-B2 Combinations of resin compositions and methods of use thereof GENERAL ELECTRIC COMPANY (US) 2006-04-04 US disclosed
US-20050266263-A1 Refractory solid, adhesive composition, and device, and associated method GENERAL ELECTRIC COMPANY 2005-12-01 US disclosed
US-20050170188-A1 Resin compositions and methods of use thereof GENERAL ELECTRIC COMPANY 2005-08-04 US disclosed
WO-2005061588-A1 NOVEL UNDERFILL MATERIAL HAVING ENHANCED ADHESION GENERAL ELECTRIC COMPANY (A NEW YORK CORPORATION) (US) 2005-07-07 WO disclosed
WO-2005062369-A1 COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-07-07 WO disclosed
US-20050131106-A1 Combinations of resin compositions and methods of use thereof MOMENTIVE PERFORMANCE MATERIALS INC. 2005-06-16 US disclosed
US-20050129956-A1 Novel underfill material having enhanced adhesion MOMENTIVE PERFORMANCE MATERIALS INC. 2005-06-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110301362-A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF EXOC1, C9, CA1 KDM4E 3276/4885GMNN 2422/4885PPM1B 4089/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.