SCHEMBL21067006

SCHEMBL21067006

CC(CBr)CI

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1821872 0.76
SCHEMBL2126615 0.76
SCHEMBL1130580 0.71
SCHEMBL6878674 0.71
SCHEMBL1977880 0.69
SCHEMBL22269916 0.69 LMNA (0.30)
SCHEMBL6275713 0.69
SCHEMBL1130591 0.67
SCHEMBL8375196 0.67
SCHEMBL115533 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4458792-B1 1-HALO-2,6,14-TRIMETHYLOCTADECANE COMPOUND AND PROCESS FOR PREPARING 5,13,17-TRIMETHYLALKANE COMPOUND THEREFROM SHINETSU CHEMICAL CO (JP) 2026-04-29 EP disclosed
EP-4464685-B1 PROCESS FOR PREPARING 17-METHYLALKANE COMPOUND SHINETSU CHEMICAL CO (JP) 2026-02-04 EP disclosed
EP-4464685-A1 PROCESS FOR PREPARING 17-METHYLALKANE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-11-20 EP disclosed
US-20240368061-A1 1-HALO-2,6,14-TRIMETHYLOCTADECANE COMPOUND AND PROCESS FOR PREPARING 5,13,17-TRIMETHYLALKANE COMPOUND THEREFROM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-11-07 US disclosed
US-20240368056-A1 PROCESS FOR PREPARING 17-METHYLALKANE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-11-07 US disclosed
EP-4458792-A1 1-HALO-2,6,14-TRIMETHYLOCTADECANE COMPOUND AND PROCESS FOR PREPARING 5,13,17-TRIMETHYLALKANE COMPOUND THEREFROM Shin-Etsu Chemical Co., Ltd. (JP) 2024-11-06 EP disclosed
CN-118878394-A Method for preparing 17-methylalkane compound 信越化学工业株式会社 2024-11-01 CN disclosed
CN-118878395-A 1-Halo-2,6,14-trimethyloctadecane compound and process for preparing 5,13,17-trimethylalkane compound therefrom 信越化学工业株式会社 2024-11-01 CN disclosed
US-11958801-B2 Process for preparing 6-isopropenyl-3-methyl-9-decenyl acetate and intermediates thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-16 US disclosed
EP-3901122-B1 PROCESS FOR PREPARING 6-ISOPROPENYL-3-METHYL-9-DECENYL ACETATE SHINETSU CHEMICAL CO (JP) 2023-11-15 EP disclosed
US-20230159412-A1 PROCESS FOR PREPARING A 3,7-DIMETHYLALKANE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 US disclosed
US-20230148099-A1 PROCESS FOR PREPARING 6-ISOPROPENYL-3-METHYL-9-DECENYL ACETATE AND INTERMEDIATES THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-11 US disclosed
US-11591282-B2 Process for preparing 6-isopropenyl-3-methyl-9-decenyl acetate and intermediates thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-02-28 US disclosed
CN-109956850-B Process for producing 3, 7-dimethyl-7-octenyl alcohol and 3, 7-dimethyl-7-octenyl carboxylate compound 信越化学工业株式会社 2022-06-21 CN disclosed
EP-3901122-A1 PROCESS FOR PREPARING 6-ISOPROPENYL-3-METHYL-9-DECENYL ACETATE AND INTERMEDIATES THEREOF Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-27 EP disclosed
CN-113527092-A Process for preparing 6-isopropenyl-3-methyl-9-decenyl acetate and intermediates thereof 信越化学工业株式会社 2021-10-22 CN disclosed
US-20210323903-A1 PROCESS FOR PREPARING 6-ISOPROPENYL-3-METHYL-9-DECENYL ACETATE AND INTERMEDIATES THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-21 US disclosed
EP-3505506-B1 METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENOL AND METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENYL CARBOXYLATE COMPOUND SHINETSU CHEMICAL CO (JP) 2021-02-03 EP disclosed
EP-3505506-A1 METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENOL AND METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENYL CARBOXYLATE COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2019-07-03 EP disclosed
US-20190194099-A1 METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENOL AND METHOD FOR PRODUCING 3,7-DIMETHYL-7-OCTENYL CARBOXYLATE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-06-27 US disclosed