SCHEMBL2108652

SCHEMBL2108652

CC(C)O[Al](C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL701646 0.75
SCHEMBL28179363 0.75
Lithium Ion SCHEMBL6692293 0.72
SCHEMBL35058 0.70
SCHEMBL6692296 0.67
SCHEMBL1268918 0.67
SCHEMBL19713197 0.64
SCHEMBL1361040 0.64
SCHEMBL2671652 0.64
SCHEMBL9064638 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260060014-A1 SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION ASM IP HOLDING B.V. (NL) 2026-02-26 US claimed
US-12482648-B2 Selective passivation and selective deposition ASM IP HOLDING B.V. (NL) 2025-11-25 US claimed
US-20260060014-A1 SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION ASM IP HOLDING B.V. (NL) 2026-02-26 US disclosed
US-12482648-B2 Selective passivation and selective deposition ASM IP HOLDING B.V. (NL) 2025-11-25 US disclosed
WO-2024215620-A1 SELECTIVELY DEPOSITING SILICON OXIDE ON A DIELECTRIC SURFACE OF A SUBSTRATE LAM RESEARCH CORPORATION (US) 2024-10-17 WO disclosed
WO-2024205914-A1 SELECTIVELY DEPOSITING A METAL OXIDE ON A DIELECTRIC SURFACE OF A SUBSTRATE LAM RESEARCH CORPORATION (US) 2024-10-03 WO disclosed
CN-110099518-A The preparation method of resin base material, the preparation method of printing distributing board, the preparation method of the preparation method of printed circuit board and e-machine JX日矿日石金属株式会社 2019-08-06 CN disclosed
EP-1892089-B1 GAS BARRIER LAMINATE, METHOD FOR PRODUCING SAME AND PACKAGE BODY USING SAME KURARAY CO (JP) 2019-05-29 EP disclosed
CN-108696998-A The copper foil of attached release layer, the manufacturing method of laminate, the manufacturing method of printing distributing board and e-machine JX金属株式会社 2018-10-23 CN disclosed
US-20180264783-A1 Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board JX NIPPON MINING & METALS CORPORATION (JP) 2018-09-20 US disclosed
CN-108401362-A The manufacturing method of metal foil, laminate, printing distributing board, semiconductor packages, e-machine and printing distributing board JX金属株式会社 2018-08-14 CN disclosed
US-6596807-B2 Saponification of a vinyl carboxylate polymer effected by functional groups of a metal alkoxide KURARAY CO., LTD. (JP) 2003-07-22 US disclosed
US-6444751-B1 GAS BARRIERS; WATERPROOFING, HEAT RESISTANCE; FOOD PACKAGING KURARAY CO., LTD. (JP) 2002-09-03 US disclosed
US-6433130-B1 POLYMERIZATION CATALYST; STABILITY SEKISUI CHEMICAL CO., LTD. (JP) 2002-08-13 US disclosed
US-20020055579-A1 Saponification of a vinyl carboxylate polymer effected by functional groups of a metal alkoxide KURARAY CO., LTD. (JP) 2002-05-09 US disclosed
US-20020026031-A1 Process for preparing polymer by using copper compound SEKISUI CHEMICAL CO., LTD (JP) 2002-02-28 US disclosed
EP-1176155-A1 Process for producing vinyl alcohol polymer compositions KURARAY CO., LTD. (JP) 2002-01-30 EP disclosed
EP-1046673-A1 PROCESS FOR PRODUCING VINYL ALCOHOL POLYMER COMPOSITION KURARAY CO., LTD. (JP) 2000-10-25 EP disclosed
CN-1262995-A Laminated film TOKUYAMA CORP (JP) 2000-08-16 CN disclosed
EP-0965600-A1 PROCESS FOR PREPARING POLYMER BY USING COPPER COMPOUND SEKISUI CHEMICAL CO., LTD. (JP) 1999-12-22 EP disclosed