SCHEMBL2114307

SCHEMBL2114307

CC(=O)Oc1cc(C)c(C)c(OC(C)=O)c1O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.53
HTT P42858 2/20 0.51
MAPT P10636 3/20 0.44
KDM4E B2RXH2 3/20 0.44
HSD17B10 Q99714 3/20 0.44
GAA P10253 2/20 0.44
TP53 P04637 1/20 0.44
ACHE P22303 2/20 0.41
PTPN1 P18031 1/20 0.41
PREP P48147 2/20 0.40
CYP3A4 P08684 2/20 0.40
CELA1 Q9UNI1 1/20 0.40
HPGD P15428 3/20 0.39
MEN1 O00255 1/20 0.39
GFER P55789 1/20 0.39
KMT2A Q03164 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
TOP1 P11387 2/20 0.39
ALDH1A1 P00352 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL7880506 0.96 POLB (0.50) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL7566198 0.87 POLB (0.54) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL7565358 0.85 POLB (0.56) POLBHTTMAPTKDM4EHSD17B10
Acetic Acid SCHEMBL7567667 0.84 POLB (0.51) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL18285026 0.81 POLB (0.41) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL27696742 0.81 POLB (0.41) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL2912166 0.81 POLB (0.56) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL14458328 0.81 POLB (0.56) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL10938410 0.80 POLB (0.49) POLBHTTMAPTKDM4EHSD17B10
SCHEMBL2910532 0.79 POLB (0.62) POLBHTTMAPTKDM4EHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 390 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117806123-B Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-05-31 CN claimed
CN-117806123-A Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 CN claimed
CN-114488690-A Chemical amplification type negative polyimide photoresist and preparation method and application thereof 中国科学院化学研究所 2022-05-13 CN claimed
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
EP-0543762-B1 Dry developable photoresist compositions and method for use thereof IBM (US) 2000-02-16 EP claimed
US-5340888-A Curable mixture of phenolic novolak resin, esterified phenolic compound and base; for foundry molds, cores BORDEN INC. (US) 1994-08-23 US claimed
US-5322765-A Dry developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-06-21 US claimed
US-5296332-A Crosslinkable aqueous developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-03-22 US claimed
EP-0377308-B1 Phenolic resins BORDEN UK LTD (GB) 1993-11-03 EP claimed
EP-0543761-A1 Crosslinkable aqueous developable photoresist compositions and method for use thereof International Business Machines Corporation (US) 1993-05-26 EP claimed
US-5051454-A An esterified phenolic compound, an unesterified phenolic resole and a base and curing BORDEN, INC. (US) 1991-09-24 US claimed
EP-0377308-A1 Phenolic resins BORDEN (UK) LIMITED (GB) 1990-07-11 EP claimed
WO-1990006904-A2 PHENOLIC RESINS BORDEN (UK) LIMITED (GB) 1990-06-28 WO claimed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-20250382492-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2025-12-18 US disclosed
US-5145913-A Decrease solubility of magnesium oxide or magnesium hydroxide hardener BORDEN, INC. (US) 1992-09-08 US disclosed
US-5096983-A Magnesium oxide and and ester as hardeners, retarder to inhibit hardening BORDEN, INC. (US) 1992-03-17 US disclosed