SCHEMBL2114432

SCHEMBL2114432

CCC(O)(C#Cc1cc[c]cc1)CC

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.34
KMT2A Q03164 1/20 0.31
ATM Q13315 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2118609 0.83 MAPT (0.44) MAPTKMT2AATM
SCHEMBL9135241 0.80 MAPT (0.51) MAPT
SCHEMBL2114163 0.79 MAPT (0.34) MAPT
SCHEMBL2117150 0.78 ASIC3 (0.41) MAPTKMT2AATM
Phenylacetylene SCHEMBL9135009 0.73 MAPT (0.45) MAPT
SCHEMBL5958205 0.73 HRH3 (0.38) MAPTKMT2AATM
SCHEMBL2116025 0.69
SCHEMBL5958140 0.69 NPSR1 (0.39)
SCHEMBL11883827 0.68 APP (0.44) MAPT
SCHEMBL11546576 0.68 MAPT (0.47) MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2555053-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-18 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
CN-101611350-B Positive-type photosensitive resin composition TORAY IND JP 2012-08-08 CN disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
CN-101611350-A Positive type photosensitive organic compound TORAY INDUSTRIES (JP) 2009-12-23 CN disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed