SCHEMBL211559

SCHEMBL211559

Nc1cnnnc1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9538391 0.97
Boric Acid SCHEMBL8843765 0.90
Phosphonic Acid SCHEMBL8950760 0.82
SCHEMBL9792855 0.79
Imidazole SCHEMBL10340213 0.78 ALDH1A1 (0.46)
SCHEMBL445993 0.77
SCHEMBL11590195 0.72
SCHEMBL3725336 0.72
SCHEMBL3725331 0.72
SCHEMBL445991 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1051 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12421435-B2 Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-23 US claimed
US-20250223163-A1 CARBON NITRIDES WITH HIGHLY CRYSTALLINE FRAMEWORK AND PROCESS FOR PRODUCING SAME THE UNIVERSITY OF NEWCASTLE (AU) 2025-07-10 US claimed
EP-4565367-A1 CARBON NITRIDES WITH HIGHLY CRYSTALLINE FRAMEWORK AND PROCESS FOR PRODUCING SAME The University of Newcastle (AU) 2025-06-11 EP claimed
CN-119798658-A Slurry, preparation method and application thereof, and high-thermal-conductivity polyimide film 济南新材料产业技术研究院 2025-04-11 CN claimed
CN-119751909-A Preparation method of quadruple hydrogen bond supermolecule material 河北工程大学 2025-04-04 CN claimed
EP-4524179-A1 CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE Shin-Etsu Chemical Co., Ltd. (JP) 2025-03-19 EP claimed
CN-119613956-A Curable maleimide resin composition, adhesive, primer, die coating agent, and semiconductor device 信越化学工业株式会社 2025-03-14 CN claimed
US-20250084216-A1 CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-03-13 US claimed
US-12084546-B2 Thermosetting resin composition, film adhesive, prepreg, and production method thereof TEIJIN LIMITED (JP) 2024-09-10 US claimed
US-20240247128-A1 CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-25 US claimed
EP-0198994-B1 POLYMERIC DIAMINO TRIAZINE DISPERSING AGENT BERGVIK KEMI AB (SE) 1988-11-02 EP claimed
EP-0097979-B1 Amino-triazine derivative and its use in heat-curable compositions SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1987-09-30 EP claimed
US-4634552-A Polymeric diamino triazine dispersing agent and preparation thereof BERGVIK KEMI AB (SE) 1987-01-06 US claimed
EP-0198994-A1 Polymeric diamino triazine dispersing agent BERGVIK KEMI AB (SE) 1986-10-29 EP claimed
US-4518725-A Fluidizing agents for hydraulic bonding materials; hydraulic bonding materials containing said fluidizing agents; method of making and using same CHRYSO S.A. (FR) 1985-05-21 US claimed
EP-0075822-B1 PROCESS FOR THE PREPARATION OF AMINOPLAST RESINS AND THEIR USE BASF Aktiengesellschaft (DE) 1985-04-24 EP claimed
EP-0023342-B1 CURABLE AND CURED MODIFIED AMINO-TRIAZINE CONDENSATES, AGENT AND PROCESS FOR THEIR PREPARATION CASSELLA Aktiengesellschaft (DE) 1983-03-02 EP claimed
US-4192933-A Non-pulverulent solid polymeric structure WESTINGHOUSE ELECTRIC CORP. (US) 1980-03-11 US claimed
US-4182695-A Polyamide-fixed biologically active protein BOEHRINGER MANNHEIM GMBH (DE) 1980-01-08 US claimed
US-4163835-A Preparation of electrolyte-free aminoplast resins CASSELLA AKTIENGESELLSCHAFT (DE) 1979-08-07 US claimed