SCHEMBL211737

SCHEMBL211737

CCO[Si](C)(OCC)O[Si](C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2960816 0.97
SCHEMBL3037560 0.97
SCHEMBL16724746 0.88
SCHEMBL274353 0.87
SCHEMBL3872463 0.87
SCHEMBL2956430 0.86
SCHEMBL34977 0.85
SCHEMBL647016 0.84
SCHEMBL646622 0.84
SCHEMBL9066630 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 327 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106343-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-05-22 WO claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
US-20250143307-A1 GRAFTABLE BIOCIDAL LINKERS AND POLYMERS AND USES THEREOF DEBOGY MOLECULAR, INC. (US) 2025-05-08 US claimed
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
WO-2023102567-A2 GRAFTABLE BIOCIDAL LINKERS AND POLYMERS AND USES THEREOF DEBOGY MOLECULAR, INC. (US) 2023-06-08 WO claimed
CN-111565859-B Surface treatment composition and method 富士胶片电子材料美国有限公司 2022-12-30 CN claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
EP-3444026-B1 MICROCAPSULES PRODUCED FROM BLENDED SOL-GEL PRECURSORS AND METHOD FOR PRODUCING THE SAME INT FLAVORS & FRAGRANCES INC (US) 2022-05-04 EP claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
CN-112898678-A Supercritical micro-foaming polypropylene material 江苏宇豪新材料科技有限公司 2021-06-04 CN claimed
US-20080199977-A1 Activated Chemical Process for Enhancing Material Properties of Dielectric Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-08-21 US claimed
EP-1959485-A2 Activated chemical process for enhancing material properties of dielectric films Air Products and Chemicals, Inc. (US) 2008-08-20 EP claimed
US-7405168-B2 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMITED (JP) 2008-07-29 US claimed
US-20080076262-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2008-03-27 US claimed
US-7345000-B2 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2008-03-18 US claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
US-5391677-A Acrylic-functional organopolysiloxane and method for the preparation thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-02-21 US claimed