SCHEMBL2118586

SCHEMBL2118586

OCCCCCCCCCCCCCCS

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.44
ALDH1A1 P00352 2/20 0.44
TSHR P16473 2/20 0.44
HSD17B10 Q99714 1/20 0.44
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
SMN1; SMN2 Q16637 2/20 0.39
FOLH1 Q04609 2/20 0.38
GPR84 Q9NQS5 1/20 0.38
FFAR1 O14842 1/20 0.38
FFAR4 Q5NUL3 1/20 0.38
MIF P14174 1/20 0.33
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4517866 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL63223 1.00
SCHEMBL9840525 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL343853 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL4533124 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL4523262 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL4529318 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL945637 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL4517354 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1
SCHEMBL4530818 1.00 LMNA (0.44) LMNAALDH1A1TSHRHSD17B10MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119528780-A Eugenol modified alkali-soluble photo-curing epoxy resin and preparation method and application thereof 广东炎墨方案科技股份有限公司 2025-02-28 CN claimed
CN-116854615-A PVC light stabilizer and preparation method thereof 南通英韦尔新材料科技有限公司 2023-10-10 CN claimed
CN-119528780-A Eugenol modified alkali-soluble photo-curing epoxy resin and preparation method and application thereof 广东炎墨方案科技股份有限公司 2025-02-28 CN disclosed
CN-116854615-A PVC light stabilizer and preparation method thereof 南通英韦尔新材料科技有限公司 2023-10-10 CN disclosed
US-10800895-B2 Polymer slides having hydrophobic small molecules STRATEC CONSUMABLES GmbH (AT) 2020-10-13 US disclosed
US-10611890-B2 Method of producing a polymer part and polymer part STRATEC CONSUMABLES GmbH (AT) 2020-04-07 US disclosed
EP-2792471-B1 Polymer parts STRATEC CONSUMABLES GmbH (AT) 2018-01-31 EP disclosed
US-20170029587-A1 METHOD OF PRODUCING A POLYMER PART AND POLYMER PART STRATEC CONSUMABLES GmbH (AT) 2017-02-02 US disclosed
US-9378962-B2 Nonvolatile semiconductor storage device having a charge storage layer that includes metal grains KABUSHIKI KAISHA TOSHIBA (JP) 2016-06-28 US disclosed
US-9279435-B2 Vibration-driven droplet transport devices University of Washington through its Center for Communication (US) 2016-03-08 US disclosed
EP-2792471-A1 Polymer parts Sony DADC Austria AG (AT) 2014-10-22 EP disclosed
US-20090123516-A1 DRUG DELIVERY FROM IMPLANTS USING SELF-ASSEMBLED MONOLAYERS-THERAPEUTIC SAMS THE BOARD OF REGENTS OF THE UNIVERSITY OF TEXAS SYSTEM 2009-05-14 US disclosed
US-20080131869-A1 Using solid support comprising immobilized biopolymers and spectral anaysis to identify preferential particles in sample INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC) (BE) 2008-06-05 US disclosed
WO-2004008550-A2 RAPID LOW-TEMPERATURE SYNTHESIS OF QUANTUM DOTS ADVANCED RESEARCH AND TECHNOLOGY INSTITUTE, INC. (US) 2004-01-22 WO disclosed
WO-2001001142-A2 ARRAYS OF BIOPOLYMERIC AGENTS AND METHOD FOR THEIR PRODUCTION AND USE CHIRON CORPORATION (US) 2001-01-04 WO disclosed
EP-0488381-B1 Polyhydroxyphenylene ether resin and process for preparing the same MITSUBISHI CHEM CORP (JP) 1997-01-29 EP disclosed
EP-0513812-B1 Thermoplastic resin composition MITSUBISHI CHEM CORP (JP) 1996-03-27 EP disclosed
US-5202409-A POLYHYDROXYPHENYLENE ETHER RESIN AND PROCESS FOR PREPARING THE SAME MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1993-04-13 US disclosed
EP-0513812-A2 Thermoplastic resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 1992-11-19 EP disclosed
EP-0488381-A1 Polyhydroxyphenylene ether resin and process for preparing the same MITSUBISHI CHEMICAL CORPORATION (JP) 1992-06-03 EP disclosed