SCHEMBL21219902

SCHEMBL21219902

CCCCCCCCC(C)C[CH]CCCC(C)CCCCCCCC

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.46
ADH1B P00325 1/20 0.42
ADH1C P00326 1/20 0.42
ADH1A P07327 1/20 0.42
ADH4 P08319 1/20 0.42
ADH7 P40394 1/20 0.42
OPRM1 P35372 1/20 0.38
PRKD3 O94806 1/20 0.37
PRKCG P05129 1/20 0.37
PRKCB P05771 1/20 0.37
PRKCA P17252 1/20 0.37
PRKCH P24723 1/20 0.37
PRKCI P41743 1/20 0.37
PRKCE Q02156 1/20 0.37
PRKCQ Q04759 1/20 0.37
PRKCZ Q05513 1/20 0.37
PRKCD Q05655 1/20 0.37
PRKD1 Q15139 1/20 0.37
SPHK1 Q9NYA1 1/20 0.36
LMNA P02545 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1971944 1.00 ACE2 (0.46) ACE2ADH1BADH1CADH1AADH4
SCHEMBL1974659 1.00 ACE2 (0.46) ACE2ADH1BADH1CADH1AADH4
SCHEMBL1971552 1.00 ACE2 (0.46) ACE2ADH1BADH1CADH1AADH4
SCHEMBL1969153 0.96 ACE2 (0.41) ACE2ADH1BADH1CADH1AADH4
SCHEMBL11615494 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4
SCHEMBL27791022 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4
SCHEMBL9627298 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4
SCHEMBL22471830 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4
SCHEMBL28317390 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4
SCHEMBL27976783 0.94 ADH1B (0.44) ACE2ADH1BADH1CADH1AADH4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023176259-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INSULATING FILM 日産化学株式会社 2023-09-21 WO disclosed
WO-2023106108-A1 PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2023-06-15 WO disclosed
WO-2023106101-A1 RESIN COMPOSITION 日産化学株式会社 2023-06-15 WO disclosed
US-11643544-B2 Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-05-09 US disclosed
CN-108349919-B Polyfunctional epoxy compound and curable composition containing the same 日产化学工业株式会社 2022-06-03 CN disclosed
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN disclosed
CN-108350252-B Epoxy reactive diluent and epoxy resin composition containing same 日产化学工业株式会社 2021-04-09 CN disclosed
US-20200347226-A1 RESIN COMPOSITION FOR INSULATING FILM NISSAN CHEMICAL CORPORATION (JP) 2020-11-05 US disclosed
CN-111566144-A Resin composition for insulating film 日产化学株式会社 2020-08-21 CN disclosed
US-20200209745-A1 PHOTOSENSITIVE RESIN COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2020-07-02 US disclosed
CN-111316165-A Photosensitive resin composition 日产化学株式会社 2020-06-19 CN disclosed
CN-110662740-A Method for producing epoxy compound 日产化学株式会社 2020-01-07 CN disclosed
US-20190241733-A1 RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2019-08-08 US disclosed