SCHEMBL2126663

SCHEMBL2126663

Nc1ccc(C(=O)Nc2cccc(NC(=O)c3ccc(N)cc3)c2)cc1

nearest known ligand 0.71

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.71
KMT2A Q03164 4/20 0.71
LMNA P02545 1/20 0.71
POLB P06746 1/20 0.71
PKM P14618 1/20 0.71
APEX1 P27695 1/20 0.71
TDP1 Q9NUW8 1/20 0.71
KCNK9 Q9NPC2 5/20 0.69
KCNK3 O14649 5/20 0.69
PTGS1 P23219 3/20 0.64
TP53 P04637 2/20 0.62
TOP1 P11387 2/20 0.61
SIRT1 Q96EB6 1/20 0.61
RAB9A P51151 2/20 0.58
TOP2A P11388 1/20 0.58
TOP2B Q02880 1/20 0.58
KCNH2 Q12809 1/20 0.56
NPC1 O15118 1/20 0.56
MAPK1 P28482 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL927121 0.93 PTGS1 (0.74) MEN1KMT2ALMNAPOLBPKM
SCHEMBL29672230 0.93 PTGS1 (0.74) MEN1KMT2ALMNAPOLBPKM
SCHEMBL17744817 0.92 PTGS1 (0.64) MEN1KMT2ALMNAPOLBPKM
SCHEMBL13335899 0.90 KCNK3 (0.67) MEN1KMT2ALMNAPOLBPKM
SCHEMBL29568808 0.89 PTGS1 (0.79) MEN1KMT2ALMNAPOLBPKM
SCHEMBL8399784 0.89 PTGS1 (0.79) MEN1KMT2ALMNAPOLBPKM
SCHEMBL682877 0.88 MEN1 (0.71) MEN1KMT2ALMNAPOLBPKM
SCHEMBL18941291 0.88 NPC1 (0.73) MEN1KMT2ALMNAPOLBPKM
SCHEMBL13972812 0.88 NPC1 (0.73) MEN1KMT2ALMNAPOLBPKM
SCHEMBL28155028 0.88 KMT2A (0.61) MEN1KMT2ALMNAPOLBPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US claimed
US-20250282996-A1 ALIGNMENT FILM COMPOSITION, DISPLAY PANEL AND METHOD OF MANUFACTURE THEREOF TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2025-09-11 US disclosed
WO-2024058164-A1 LIQUID CRYSTAL ALIGNING AGENT AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2024-03-21 WO disclosed
WO-2023171690-A1 WEAK-ANCHORING LIQUID CRYSTAL ALIGNING AGENT AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2023-09-14 WO disclosed
WO-2023157879-A1 WEAK-ANCHORING LIQUID CRYSTAL ALIGNING AGENT, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2023-08-24 WO disclosed
WO-2023140322-A1 WEAK-ANCHORING LIQUID CRYSTAL ALIGNMENT AGENT, AND LIQUID CYRSTAL DISPLAY ELEMENT 日産化学株式会社 2023-07-27 WO disclosed
WO-2023120726-A1 WEAK-ANCHORING LIQUID CRYSTAL ALIGNMENT AGENT, AND LIQUID CYRSTAL DISPLAY ELEMENT 日産化学株式会社 2023-06-29 WO disclosed
WO-2023048278-A1 WEAKLY ANCHORING LIQUID-CRYSTAL ALIGNMENT AGENT, LIQUID-CRYSTAL DISPLAY ELEMENT, AND POLYMER 日産化学株式会社 2023-03-30 WO disclosed
WO-2022260048-A1 WEAK ANCHORING LIQUID CRYSTAL ALIGNING AGENT, LIQUID CYRSTAL DISPLAY ELEMENT AND COPOLYMER 日産化学株式会社 2022-12-15 WO disclosed
WO-2022196565-A1 LIQUID-CRYSTAL COMPOSITION, LIQUID-CRYSTAL DISPLAY ELEMENT PRODUCTION METHOD, AND LIQUID-CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2022-09-22 WO disclosed
EP-1141163-A1 POLYAMIDEIMIDESILOXANE HOT MELT ADHESIVE Sumitomo Bakelite Company Limited (JP) 2001-10-10 EP disclosed
EP-1111442-A1 TREATING AGENT FOR LIQUID CRYSTAL ALIGNMENT LAYER AND LIQUID CRYSTAL DEVICE USING THE SAME, AND METHOD FOR ALIGNMENT OF LIQUID CRYSTAL Nissan Chemical Industries, Ltd. (JP) 2001-06-27 EP disclosed
US-6156820-A Polyamideimidesiloxane hot melt adhesive OCCIDENTAL CHEMICAL CORPORATION (US) 2000-12-05 US disclosed
WO-2000039236-A1 POLYAMIDEIMIDESILOXANE HOT MELT ADHESIVE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-07-06 WO disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0124085-B1 UNDERCOATING COMPOSITION Daikin Kogyo Co., Ltd. (JP) 1988-03-02 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4548986-A MODIFIED TETRAFLUOROETHYLENE POLYMERS DAIKIN KOGYO CO., LTD. (JP) 1985-10-22 US disclosed
EP-0124085-A2 Undercoating composition Daikin Kogyo Co., Ltd. (JP) 1984-11-07 EP disclosed