Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.83 |
| ▸ | MEN1 | O00255 | 1/20 | 0.80 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.80 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.80 |
| ▸ | GNAI3 | P08754 | 9/20 | 0.75 |
| ▸ | GNAI1 | P63096 | 9/20 | 0.75 |
| ▸ | GNAO1 | P09471 | 8/20 | 0.65 |
| ▸ | ATM | Q13315 | 1/20 | 0.56 |
| ▸ | POLB | P06746 | 1/20 | 0.55 |
| ▸ | NPC1 | O15118 | 1/20 | 0.52 |
| ▸ | NAAA | Q02083 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | FAAH | O00519 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6285463 | 1.00 | L3MBTL1 (0.83) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL7060548 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL8972980 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL9415758 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL8972823 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL8972813 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL4450061 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL768398 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL1045855 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 | |
| SCHEMBL8972566 | 0.98 | L3MBTL1 (0.80) | L3MBTL1MEN1KMT2ATDP1GNAI3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2960314-B1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | FUJIMI INC (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-11897081-B2 | Method for polishing silicon substrate and polishing composition set | FUJIMI INCORPORATED (JP) | 2024-02-13 | — | — | US | disclosed |
| EP-3159915-B1 | METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET | FUJIMI INC (JP) | 2023-12-06 | — | — | EP | disclosed |
| EP-2977423-B1 | POLISHING COMPOSITION | FUJIMI INC (JP) | 2022-09-28 | — | — | EP | disclosed |
| CN-106463386-B | Method for polishing silicon wafer, polishing composition, and polishing composition set | 福吉米株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-109071685-B | Terminal-modified conjugated diene polymer, rubber composition, and rubber article | 株式会社普利司通 | 2020-12-01 | — | — | CN | disclosed |
| EP-2957613-B1 | POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INC (JP) | 2020-11-18 | — | — | EP | disclosed |
| US-10717899-B2 | Polishing composition, method for producing polishing composition and polishing composition preparation kit | FUJIMI INCORPORATED (JP) | 2020-07-21 | — | — | US | disclosed |
| WO-2020054484-A1 | MODIFIED MULTI-COMPONENT COPOLYMER, RUBBER COMPOSITION, RESIN COMPOSITION, TIRE AND RESIN PRODUCT | 株式会社ブリヂストン | 2020-03-19 | — | — | WO | disclosed |
| EP-3053978-B1 | POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME | FUJIMI INC (JP) | 2019-11-06 | — | — | EP | disclosed |
| EP-2840591-A1 | COMPOSITION FOR SILICON WAFER POLISHING LIQUID | Kao Corporation (JP) | 2015-02-25 | — | — | EP | disclosed |
| US-8926859-B2 | Polishing composition for silicon wafers | KAO CORPORATION (JP) | 2015-01-06 | — | — | US | disclosed |
| CN-101807018-B | Developing agent and method for producing the same | TOSHIBA TEC KK | 2013-10-16 | — | — | CN | disclosed |
| CN-102445870-B | Electrophotographic toner and method for producing the same | TOSHIBA TEC KK | 2013-08-07 | — | — | CN | disclosed |
| CN-102445870-A | Toner for electrophotography and method for producing the same | TOSHIBA TEC KK | 2012-05-09 | — | — | CN | disclosed |
| US-20120108064-A1 | POLISHING COMPOSITION FOR SILICON WAFERS | KAO CORPORATION (JP) | 2012-05-03 | — | — | US | disclosed |
| EP-2444996-A1 | POLISHING LIQUID COMPOSITION FOR SILICON WAFERS | Kao Corporation (JP) | 2012-04-25 | — | — | EP | disclosed |
| CN-102239211-A | Rubber composition | BRIDGESTONE CORP | 2011-11-09 | — | — | CN | disclosed |
| CN-101807018-A | Developer and manufacture method thereof | TOSHIBA TEC KK | 2010-08-18 | — | — | CN | disclosed |
| CN-101175817-A | Lactic acid polymer composition, molded article comprising the composition, and process for producing the molded article | MITSUI CHEMICALS INC (JP) | 2008-05-07 | — | — | CN | disclosed |