SCHEMBL2138382

SCHEMBL2138382

CCCCCCCCC(S)(CCCCCCCC)C(=O)[O-].CCCCCCCCC(S)(CCCCCCCC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.37

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CES2 O00748 4/20 0.37
CES1 P23141 3/20 0.36
GGPS1 O95749 6/20 0.35
FDPS P14324 8/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10484771 1.00 CES2 (0.37) CES2CES1GGPS1FDPS
SCHEMBL11833168 0.97 CES2 (0.37) CES2CES1GGPS1FDPS
SCHEMBL3627944 0.97 CES2 (0.37) CES2CES1GGPS1FDPS
SCHEMBL5636784 0.93 CES2 (0.35) CES2CES1GGPS1FDPS
SCHEMBL10714540 0.93 CA1 (0.33) CES2CES1
SCHEMBL11038791 0.90 CES2 (0.35) CES2CES1GGPS1FDPS
SCHEMBL28663086 0.89 CA1 (0.38) CES2
SCHEMBL2083946 0.88 CA1 (0.37)
SCHEMBL31087040 0.87 CES2 (0.40) CES2CES1GGPS1FDPS
SCHEMBL11866146 0.87 CES2 (0.40) CES2CES1GGPS1FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1223190-B1 Room temperature curable organopolysiloxane composition for molding SHINETSU CHEMICAL CO (JP) 2011-10-12 EP claimed
US-7078460-B2 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-07-18 US claimed
US-20040010109-A1 Room temperature curable organopolysiloxane composition for molding SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-15 US claimed
US-5719255-A HOT MELT ADHESIVE FOR POLYVINYL CHLORIDE HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1998-02-17 US claimed
US-20250270427-A1 ADHESIVE COMPOSITION AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2025-08-28 US disclosed
CN-110050051-B Adhesive composition and use thereof 东亚合成株式会社 2022-04-12 CN disclosed
US-20210207009-A1 ADHESIVE COMPOSITION AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2021-07-08 US disclosed
CN-112639043-A Adhesive composition and use thereof 东亚合成株式会社 2021-04-09 CN disclosed
CN-107406659-B Wire coating material composition, insulated wire, and wire harness AUTONETWORKS TECHNOLOGIES, LTD. (JP) 2019-12-10 CN disclosed
US-9093197-B2 Composition for wire coating member, insulated wire, and wiring harness AUTONETWORKS TECHNOLOGIES, LTD. (JP) 2015-07-28 US disclosed
CN-103097458-B Composition for wire coating material, insulated wire and wire harness AUTONETWORKS TECHNOLOGIES LTD 2014-12-03 CN disclosed
US-8895857-B2 Flame-retardant composition and insulated wire, and method for producing flame-retardant composition AUTONETWORKS TECHNOLOGIES, LTD. (JP) 2014-11-25 US disclosed
US-4464495-A FLAME RESISTANT; COPPER OXALATE; AMINE MOLYBDATE; TITANIUM DIOXIDE; VINYL CHLORIDE POLMER; ALUMINUM TRIHYDRATE; CALCIUM CARBONATE THE B. F. GOODRICH COMPANY (US) 1984-08-07 US disclosed
EP-0094602-A2 Smoke retardant vinyl halide polymer compositions The B.F. GOODRICH Company (US) 1983-11-23 EP disclosed
EP-0094604-A2 Smoke retardant vinyl halide polymer compositions The B.F. GOODRICH Company (US) 1983-11-23 EP disclosed
US-4396649-A CHAIN EXTENDED WITH TERTIARY AMINOESTERPOLYOL INTEROX CHEMICALS LIMITED (GB) 1983-08-02 US disclosed
US-4348273-A Treating cracking catalyst fines containing a passivating material PHILLIPS PETROLEUM COMPANY (US) 1982-09-07 US disclosed
EP-0054194-A2 Epoxy resins and emulsions made therefrom Interox Chemicals Limited (GB) 1982-06-23 EP disclosed
US-4286958-A AFTER MODIFICATION OF FIBERS WITH A BENZENESULFONYL CHLORIDE TOPPAN PRINTING CO., LTD. (JP) 1981-09-01 US disclosed
US-4268188-A TIN, INDIUM, OR COMPOUND OF TIN OR INDIUM PHILLIPS PETROLEUM COMPANY (US) 1981-05-19 US disclosed