SCHEMBL21384932

SCHEMBL21384932

[CH2]CCc1ccc(Oc2ccc(N)cc2)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.58
TDP1 Q9NUW8 2/20 0.58
CYP3A4 P08684 1/20 0.58
TSHR P16473 1/20 0.58
GFER P55789 2/20 0.52
MAOA P21397 4/20 0.50
MAPT P10636 5/20 0.48
MAOB P27338 3/20 0.48
TEAD4 Q15561 1/20 0.48
SMN1; SMN2 Q16637 2/20 0.47
POLB P06746 1/20 0.47
MEN1 O00255 1/20 0.47
MITF O75030 1/20 0.47
GAA P10253 1/20 0.47
KMT2A Q03164 1/20 0.47
NLRP1 Q9C000 1/20 0.47
NOD2 Q9HC29 1/20 0.47
NPC1 O15118 3/20 0.44
RAB9A P51151 3/20 0.44
CYP19A1 P11511 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL309841 0.87 ALDH1A1 (0.70) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL12110749 0.87 ALDH1A1 (0.70) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL3958673 0.87 GFER (0.68) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL12110715 0.83 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL12110748 0.83 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL712164 0.83 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL1049649 0.83 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL1857603 0.83 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL6363455 0.81 ALDH1A1 (0.61) ALDH1A1TDP1CYP3A4TSHRGFER
SCHEMBL12110687 0.81 ALDH1A1 (0.61) ALDH1A1TDP1CYP3A4TSHRGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115210077-A Low dielectric composite film for copper-clad laminate and copper-clad laminate comprising same 象牙弗隆泰克株式会社 2022-10-18 CN disclosed
WO-2019181721-A1 CURABLE RESIN COMPOSITION, ADHESIVE, ADHESIVE FILM, COVER LAY FILM, AND FLEXIBLE COPPER-CLAD LAMINATE 積水化学工業株式会社 2019-09-26 WO disclosed