⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1976961 | 0.79 | — | — | |
| SCHEMBL270155 | 0.78 | — | — | |
| SCHEMBL22974944 | 0.68 | — | — | |
| SCHEMBL28452615 | 0.66 | TSHR (0.57) | — | |
| SCHEMBL3918689 | 0.66 | — | — | |
| SCHEMBL276806 | 0.65 | FDPS (0.32) | — | |
| SCHEMBL11005686 | 0.64 | TSHR (0.35) | — | |
| SCHEMBL15334140 | 0.63 | — | — | |
| SCHEMBL9122760 | 0.63 | — | — | |
| SCHEMBL7323593 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3778715-B1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | TORAY INDUSTRIES (JP) | 2022-05-25 | — | — | EP | disclosed |
| US-20210371599-A1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | TORAY INDUSTRIES, INC. (JP) | 2021-12-02 | — | — | US | disclosed |
| EP-3778715-A1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | Toray Industries, Inc. (JP) | 2021-02-17 | — | — | EP | disclosed |
| WO-2019188835-A1 | POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD | 東レ株式会社 | 2019-10-03 | — | — | WO | disclosed |