SCHEMBL214612

SCHEMBL214612

C=C(C)C(=O)OC1(CCCCOC)C2CC3CC(C2)CC1C3

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 3/20 0.35
TSHR P16473 3/20 0.33
ALDH1A1 P00352 3/20 0.32
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14580043 0.96 EPHX2 (0.35) EPHX2TSHRALDH1A1MEN1KMT2A
SCHEMBL14272252 0.90 MEN1 (0.35) EPHX2TSHRALDH1A1MEN1KMT2A
SCHEMBL14523963 0.88 EPHX2 (0.34) EPHX2TSHRALDH1A1MEN1KMT2A
SCHEMBL14580049 0.87 THRB (0.41) EPHX2TSHRALDH1A1
SCHEMBL13171802 0.86 CYP4F2 (0.31) EPHX2ALDH1A1
SCHEMBL4401855 0.86 TSHR (0.41) EPHX2TSHRALDH1A1
SCHEMBL4401860 0.85 TSHR (0.43) EPHX2TSHR
SCHEMBL4403811 0.85 TSHR (0.43) EPHX2TSHR
SCHEMBL4399200 0.85 TSHR (0.43) EPHX2TSHR
SCHEMBL14523965 0.85 EPHX2 (0.34) EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20060121390-A1 High resolution resists for next generation lithographies NATIONAL SCIENCE FOUNDATION 2006-06-08 US claimed
US-20250189896-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-06-12 US disclosed
US-20250136734-A1 PROTECTIVE-FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-05-01 US disclosed
CN-118742856-A Composition for forming protective film 日产化学株式会社 2024-10-01 CN disclosed
WO-2023162653-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION 日産化学株式会社 2023-08-31 WO disclosed
WO-2023157772-A1 PROTECTIVE FILM FORMING COMPOSITION 日産化学株式会社 2023-08-24 WO disclosed
US-11592747-B2 Resist underlayer film-forming composition comprising carbonyl-containing polyhydroxy aromatic ring novolac resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-02-28 US disclosed
US-11199777-B2 Resist underlayer film-forming composition containing novolac polymer having secondary amino group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2021-12-14 US disclosed
CN-104412163-B Method for manufacturing semiconductor device using composition for forming organic underlayer film for solvent development lithography process 日产化学工业株式会社 2020-05-22 CN disclosed
US-20160326396-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING NOVOLAC POLYMER HAVING SECONDARY AMINO GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-11-10 US disclosed
US-20070083021-A1 Fluorocopolymer, method for its production and resist composition containing it ASAHI GLASS COMPANY, LIMITED (JP) 2007-04-12 US disclosed
US-7195856-B2 Positive resist composition and pattern formation method using the same FUJIFILM CORPORATION (JP) 2007-03-27 US disclosed
US-7175963-B2 Chemical amplification type positive resist composition and a resin therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-02-13 US disclosed
US-7175963-B2 Chemical amplification type positive resist composition and a resin therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-02-13 US disclosed
US-20060234156-A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-10-19 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
US-20060121390-A1 High resolution resists for next generation lithographies NATIONAL SCIENCE FOUNDATION 2006-06-08 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
EP-1617289-A1 COMPOSITION FOR FORMATION OF UNDERLAYER FILM FOR LITHOGRAPHY CONTAINING EPOXY COMPOUND AND CARBOXYLIC ACID COMPOUND Nissan Chemical Industries, Ltd. (JP) 2006-01-18 EP disclosed
WO-2003104182-A1 2-ALKOXYALKYL-2-ADAMANTYL (METH)ACRYLATE AND METHOD FOR PREPARING SAME ENF TECHNOLOGY CO., LTD. (KR) 2003-12-18 WO disclosed