SCHEMBL21462873

SCHEMBL21462873

IC=c1ccccc1=c1ccccc1=CI

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21647884 1.00
SCHEMBL8023274 0.75
SCHEMBL21647857 0.75
SCHEMBL23350320 0.71
SCHEMBL21647868 0.69
SCHEMBL21647867 0.69
SCHEMBL21647881 0.69 LMNA (0.30)
SCHEMBL21647880 0.69 LMNA (0.30)
SCHEMBL8759821 0.69 TSHR (0.30)
SCHEMBL10066554 0.62 TDP1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12595334-B2 Compound, mixture, curable resin composition and cured product thereof, and method for producing compound NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-07 US disclosed
US-20230002547-A1 COMPOUND, MIXTURE, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING COMPOUND NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-01-05 US disclosed
CN-112105673-A Aromatic amine resin having N-alkyl group, curable resin composition, and cured product thereof 日本化药株式会社 2020-12-18 CN disclosed
WO-2020027179-A1 AROMATIC AMINE RESIN HAVING N-ALKYL GROUP, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 日本化薬株式会社 2020-02-06 WO disclosed
WO-2019198606-A1 ALKENYL-GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM 日本化薬株式会社 2019-10-17 WO disclosed