SCHEMBL214671

SCHEMBL214671

CC(O)/C=C/O/C=C/C(C)O

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7750704 0.84
SCHEMBL2834943 0.83
Acrylic Acid SCHEMBL11909821 0.81 LMNA (0.43) ALDH1A1LMNA
SCHEMBL4996198 0.75
SCHEMBL22661040 0.75
SCHEMBL4996194 0.75
SCHEMBL1931724 0.73
SCHEMBL1931727 0.73
SCHEMBL29886820 0.73
SCHEMBL1476548 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 272 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6951705-B2 Polymers for photoresist compositions for microlithography E. I. DU PONT DE NEMOURS AND COMPANY (US) 2005-10-04 US claimed
US-20030211417-A1 Polymers for photoresist compositions for microlithography DUPONT ELECTRONICS, INC. 2003-11-13 US claimed
EP-1279069-A2 POLYMERS FOR PHOTORESIST COMPOSITIONS FOR MICROLITHOGRAPHY E.I. DU PONT DE NEMOURS AND COMPANY (US) 2003-01-29 EP claimed
WO-2001086352-A2 POLYMERS FOR PHOTORESIST COMPOSITIONS FOR MICROLITHOGRAPHY E.I. DU PONT DE NEMOURS AND COMPANY (US) 2001-11-15 WO claimed
JP-7033840-A None JP disclosed
EP-4651688-A1 DEVICE AND METHOD FOR MANUFACTURING DEVICE Toyobo Co., Ltd. (JP) 2025-11-19 EP disclosed
US-20250215269-A1 ADHESIVE FILM FOR WAFER BACK GRINDING INNOX ADVANCED MATERIALS CO., LTD. (KR) 2025-07-03 US disclosed
CN-119965211-A Negative electrode for rechargeable lithium battery and rechargeable lithium battery including the same 三星SDI株式会社 2025-05-09 CN disclosed
CN-119604543-A Chain transfer agent, method for producing polymer, adhesive composition, and polymer particle 国立大学法人信州大学 2025-03-11 CN disclosed
CN-112300729-B Double-sided pressure-sensitive adhesive tape 日东电工株式会社 2025-02-18 CN disclosed
CN-116368198-B Adhesive composition for pavement or floor and marking sheet 综研化学株式会社 2025-02-14 CN disclosed
CN-113388331-B Re-releasable adhesive tape 日东电工株式会社 2025-02-14 CN disclosed
JP-H0733840-A RADIATION CURING RESIN COMPOSITION AND ITS CURED PRODUCT NIPPON KAYAKU CO LTD 1995-02-03 JP disclosed
US-5376378-A Transdermal drug delivery CIBA-GEIGY CORP. (US) 1994-12-27 US disclosed
EP-0611783-A1 Copolymers of (meth)acryloxy-alkyl-siloxysilane and alkyl(meth)acrylates and the use thereof as pressure sensitive adhesives CIBA-GEIGY AG (CH) 1994-08-24 EP disclosed
US-5322890-A Room temperature cross-linkage aqueous composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1994-06-21 US disclosed
EP-0598294-A2 Room temperature cross-linkable aqueous composition and process for preparing the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1994-05-25 EP disclosed
US-5288827-A Drug selivery CIBA-GEIGY CORPORATION (US) 1994-02-22 US disclosed
US-4916053-A INCLUDING AN AMIDE-OR IMIDE-CONTAINING VINYL POLYMER IN THE CRYSTALLINE EMULSION LAYER; HIGH SENSITIVITY, GOOD GRAININESS AND LOW FOG IN NEGATIVE-TYPE MATERIEALS FUJI PHOTO FILM CO., LTD. (JP) 1990-04-10 US disclosed
US-RE29772-E IMPACT STRENGTH, CLARITY, WEATHER RESISTANCE ROHM AND HAAS COMPANY (US) 1978-09-19 US disclosed