SCHEMBL2148561

SCHEMBL2148561

CO[C](OC)C(C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6372840 0.69
SCHEMBL6372837 0.69
SCHEMBL7580898 0.67 SMN1; SMN2 (0.48)
SCHEMBL387412 0.67
SCHEMBL35974 0.67
SCHEMBL11300053 0.67
SCHEMBL30714951 0.67
SCHEMBL16377936 0.67
SCHEMBL2664131 0.67
SCHEMBL4263960 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020248830-A1 BULK AEROGEL, BULK AEROGEL PHASE CHANGE COMPOSITE MATERIAL, RREPARATION METHODS THEREFOR AND APPLICATIONS THEREOF 苏州阿德旺斯新材料有限公司 2020-12-17 WO claimed
EP-2079802-B1 CURABLE SILICONE COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2014-05-21 EP disclosed
US-20110163482-A1 PHOTO-CURABLE COMPOSITION HAVING INHERENTLY EXCELLENT RELEASING PROPERTY AND PATTERN TRANSFER PROPERTY, METHOD FOR TRANSFERRING PATTERN USINGTHE COMPOSITION AND LIGHT RECORDING MEDIUM HAVING POLYMER PATTERN LAYER PRODUCED USING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-07-07 US disclosed
US-20100022704-A1 Curable Silicone Composition And Cured Body Thereof DOW CORNING TORAY COMPANY, LTD. (JP) 2010-01-28 US disclosed
EP-2079802-A1 CURABLE SILICONE COMPOSITION AND CURED BODY THEREOF Dow Corning Toray Co., Ltd. (JP) 2009-07-22 EP disclosed
US-20080176049-A1 PHOTO-CURABLE COMPOSITION HAVING INHERENTLY EXCELLENT RELEASING PROPERtY AND PATTERN TRANSFER PROPERTY, METHOD FOR TRANSFERRING PATTERN USING THE COMPOSITION AND LIGHT RECORDING MEDIUM HAVING POLYMER PATTERN LAYER PRODUCED USING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-07-24 US disclosed
WO-2008041459-A1 CURABLE SILICONE COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO., LTD. (JP) 2008-04-10 WO disclosed
US-5616446-A Silver halide photographic light-sensitive material KONICA CORPORATION (JP) 1997-04-01 US disclosed
EP-0704757-A1 A silver halide photographic light sensitive material KONICA CORPORATION (JP) 1996-04-03 EP disclosed
US-5073471-A Comprising dispersed resin grains of an acrylic polymer of an unsaturated ester, an acrylic stabilizer and an oligomer; antisoilants; antisticking agents FUJI PHOTO FILM CO., LTD. (JP) 1991-12-17 US disclosed
US-4282136-A SUCH AS SEMICONDUCTORS USING ANTIMONY PENTOXIDE AND A REACTIVE ORGANIC BROMINE COMPOUND AS FLAME RETARDANTS ROHM & HAAS COMPANY 1981-08-04 US disclosed