SCHEMBL21523397

SCHEMBL21523397

Cc1ccc[n+](CCCCS(=O)(=O)[O-])c1

nearest known ligand 0.69

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
PABPC1 P11940 2/20 0.48
EIF4H Q15056 1/20 0.48
CTDSP1 Q9GZU7 1/20 0.48
KDM4E B2RXH2 5/20 0.43
ALDH1A1 P00352 4/20 0.43
RXFP1 Q9HBX9 1/20 0.43
LMNA P02545 2/20 0.41
GGPS1 O95749 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
GAA P10253 1/20 0.41
HPGD P15428 1/20 0.41
KMT2A Q03164 1/20 0.41
ATM Q13315 1/20 0.41
APAF1 O14727 1/20 0.41
POLB P06746 1/20 0.41
MAPT P10636 1/20 0.41
RAD52 P43351 1/20 0.41
BLM P54132 1/20 0.41
TDP1 Q9NUW8 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21523393 0.95 PABPC1 (0.53) PABPC1EIF4HCTDSP1KDM4EALDH1A1
SCHEMBL8739576 0.84 KDM4E (0.53) PABPC1KDM4EALDH1A1LMNAKMT2A
SCHEMBL29558847 0.84 KDM4E (0.45) PABPC1KDM4EALDH1A1LMNAGGPS1
SCHEMBL30329907 0.84 HTT (0.51) KDM4EALDH1A1LMNAAPAF1POLB
SCHEMBL28667234 0.84 KDM4E (0.45) PABPC1KDM4EALDH1A1LMNAGGPS1
SCHEMBL21523391 0.83 HTT (0.53) PABPC1EIF4HCTDSP1KDM4EALDH1A1
SCHEMBL29252416 0.83 HTT (0.54) ALDH1A1LMNAAPAF1RAD52BLM
SCHEMBL30330039 0.83 HTT (0.54) ALDH1A1LMNAAPAF1RAD52BLM
SCHEMBL30330387 0.83 HTT (0.54) ALDH1A1LMNAAPAF1RAD52BLM
SCHEMBL29252161 0.83 HTT (0.54) ALDH1A1LMNAAPAF1RAD52BLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190330753-A1 NICKEL (ALLOY) ELECTROPLATING SOLUTION JAPAN PURE CHEMICAL CO., LTD. (JP) 2019-10-31 US claimed
US-20190330753-A1 NICKEL (ALLOY) ELECTROPLATING SOLUTION JAPAN PURE CHEMICAL CO., LTD. (JP) 2019-10-31 US disclosed